linux-kernel - Re: [PATCH 2/6] dt-bindings: thermal: tsens: Add compatible for MSM8226

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Message-ID: <3e546d87-42ff-fbe1-da50-6f84460a10bf@linaro.org>
Date:   Wed, 10 May 2023 15:57:56 +0200
From:   Krzysztof Kozlowski <krzysztof.kozlowski@...aro.org>
To:     Matti Lehtimäki <matti.lehtimaki@...il.com>,
        linux-arm-msm@...r.kernel.org
Cc:     ~postmarketos/upstreaming@...ts.sr.ht, phone-devel@...r.kernel.org,
        Amit Kucheria <amitk@...nel.org>,
        Thara Gopinath <thara.gopinath@...il.com>,
        Andy Gross <agross@...nel.org>,
        Bjorn Andersson <andersson@...nel.org>,
        Konrad Dybcio <konrad.dybcio@...aro.org>,
        "Rafael J. Wysocki" <rafael@...nel.org>,
        Daniel Lezcano <daniel.lezcano@...aro.org>,
        Zhang Rui <rui.zhang@...el.com>,
        Rob Herring <robh+dt@...nel.org>,
        Krzysztof Kozlowski <krzysztof.kozlowski+dt@...aro.org>,
        linux-pm@...r.kernel.org, devicetree@...r.kernel.org,
        linux-kernel@...r.kernel.org
Subject: Re: [PATCH 2/6] dt-bindings: thermal: tsens: Add compatible for
 MSM8226

On 07/05/2023 22:12, Matti Lehtimäki wrote:
> Qualcomm MSM8226 has tsens v0.1 block.
> 
> Signed-off-by: Matti Lehtimäki <matti.lehtimaki@...il.com>
> ---

Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@...aro.org>

Bot's errors can be ignored.

Best regards,
Krzysztof