linux-kernel - Re: [PATCH] dt-bindings: iio: temperature: Add DT bindings for TMP006

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Message-ID: <ZF08pzGPyReL1uAf@yoga>
Date:   Fri, 12 May 2023 00:36:15 +0530
From:   Anup Sharma <anupnewsmail@...il.com>
To:     Krzysztof Kozlowski <krzysztof.kozlowski@...aro.org>
Cc:     Anup Sharma <anupnewsmail@...il.com>,
        Jonathan Cameron <jic23@...nel.org>,
        Lars-Peter Clausen <lars@...afoo.de>,
        Rob Herring <robh+dt@...nel.org>,
        Krzysztof Kozlowski <krzysztof.kozlowski+dt@...aro.org>,
        Conor Dooley <conor+dt@...nel.org>,
        Peter Meerwald <pmeerw@...erw.net>, broonie@...nel.org,
        linux-iio@...r.kernel.org, devicetree@...r.kernel.org,
        linux-kernel@...r.kernel.org
Subject: Re: [PATCH] dt-bindings: iio: temperature: Add DT bindings for TMP006

On Thu, May 11, 2023 at 11:28:50AM +0200, Krzysztof Kozlowski wrote:
> On 10/05/2023 20:56, Anup Sharma wrote:
> > Add devicetree binding document for TMP006, IR thermopile sensor.
> 
> Why? Where is any user of this? DTS? Driver?
> 

The support for TMP006 is available at driver/iio/temperature

> Subject: drop second/last, redundant "DT bindings for". The
> "dt-bindings" prefix is already stating that these are bindings.
>

Okay, will take care in v2. 

> > 
> > Signed-off-by: Anup Sharma <anupnewsmail@...il.com>
> > ---
> >  .../bindings/iio/temperature/ti,tmp006.yaml   | 38 +++++++++++++++++++
> >  1 file changed, 38 insertions(+)
> >  create mode 100644 Documentation/devicetree/bindings/iio/temperature/ti,tmp006.yaml
> > 
> > diff --git a/Documentation/devicetree/bindings/iio/temperature/ti,tmp006.yaml b/Documentation/devicetree/bindings/iio/temperature/ti,tmp006.yaml
> > new file mode 100644
> > index 000000000000..c6c5a4d10898
> > --- /dev/null
> > +++ b/Documentation/devicetree/bindings/iio/temperature/ti,tmp006.yaml
> > @@ -0,0 +1,38 @@
> > +# SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause)
> > +%YAML 1.2
> > +---
> > +$id: http://devicetree.org/schemas/iio/temperature/ti,tmp006.yaml#
> > +$schema: http://devicetree.org/meta-schemas/core.yaml#
> > +
> > +title: TI TMP006 IR thermopile sensor
> > +
> > +maintainers:
> > +  - Peter Meerwald <pmeerw@...erw.net>
> > +
> > +description: |
> > +  TI TMP006 - Infrared Thermopile Sensor in Chip-Scale Package.
> > +  https://cdn.sparkfun.com/datasheets/Sensors/Temp/tmp006.pdf
> > +
> > +properties:
> > +  compatible:
> > +    const: ti,tmp006
> > +
> > +  reg:
> > +    maxItems: 1
> 
> Missing supply.
>

Will add in v2.

> > +
> > +required:
> > +  - compatible
> > +  - reg
> > +
> > +additionalProperties: false
> > +
> > +examples:
> > +  - |
> > +    i2c {
> > +        #address-cells = <1>;
> > +        #size-cells = <0>;
> > +        tmp006@40 {
> 
> Node names should be generic.
> https://devicetree-specification.readthedocs.io/en/latest/chapter2-devicetree-basics.html#generic-names-recommendation
> 
> temperature-sensor?
>

Thanks, I have noticed that out of the 8 temperature sensor bindings,
5 are using 'temp-sensor' as the node name, 2 are using 'temperature-sensor',
and 1 is non-generic. According to this docs generic names recommendation
'temperature-sensor' seems to be ideal node name. Should I also proceed
updating all the temperature sensor's node names to a generic format?

> > +            compatible = "ti,tmp006";
> > +            reg = <0x40>;
> > +        };
> > +    };
> 
> Best regards,
> Krzysztof
>