linux-kernel - Re: [PATCH 1/2] dt-bindings: iio: temperature: Add support for tmp006

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Date:   Mon, 15 May 2023 08:17:50 +0200
From:   Krzysztof Kozlowski <krzysztof.kozlowski@...aro.org>
To:     Anup Sharma <anupnewsmail@...il.com>,
        Jonathan Cameron <jic23@...nel.org>,
        Lars-Peter Clausen <lars@...afoo.de>,
        Rob Herring <robh+dt@...nel.org>,
        Krzysztof Kozlowski <krzysztof.kozlowski+dt@...aro.org>,
        Conor Dooley <conor+dt@...nel.org>,
        Peter Meerwald <pmeerw@...erw.net>,
        u.kleine-koenig@...gutronix.de, andriy.shevchenko@...ux.intel.com,
        linux-iio@...r.kernel.org, devicetree@...r.kernel.org,
        linux-kernel@...r.kernel.org
Subject: Re: [PATCH 1/2] dt-bindings: iio: temperature: Add support for tmp006

On 14/05/2023 21:01, Anup Sharma wrote:
> Add devicetree binding document for TMP006, IR thermopile sensor.
> 
> Signed-off-by: Anup Sharma <anupnewsmail@...il.com>
> 

Missing ---


> Changes:
> V1 -> V2: Removed redundant dt-binding from subject.
>           Added supply information.
>           Adhere to the generic node name.
> ---


Best regards,
Krzysztof