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Date:   Tue, 13 Jun 2023 10:26:58 +0200
From:   Daniel Lezcano <daniel.lezcano@...aro.org>
To:     Varadarajan Narayanan <quic_varada@...cinc.com>, agross@...nel.org,
        andersson@...nel.org, konrad.dybcio@...aro.org, amitk@...nel.org,
        thara.gopinath@...il.com, rafael@...nel.org, rui.zhang@...el.com,
        robh+dt@...nel.org, krzysztof.kozlowski+dt@...aro.org,
        conor+dt@...nel.org, linux-arm-msm@...r.kernel.org,
        linux-pm@...r.kernel.org, devicetree@...r.kernel.org,
        linux-kernel@...r.kernel.org
Cc:     Praveenkumar I <quic_ipkumar@...cinc.com>
Subject: Re: [PATCH v6 1/3] dt-bindings: thermal: tsens: Add ipq9574
 compatible

On 07/06/2023 10:53, Varadarajan Narayanan wrote:
> From: Praveenkumar I <quic_ipkumar@...cinc.com>
> 
> Qualcomm IPQ9574 has tsens v2.3.1 block, which is similar to IPQ8074 tsens.
> 
> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@...aro.org>
> Signed-off-by: Praveenkumar I <quic_ipkumar@...cinc.com>
> Signed-off-by: Varadarajan Narayanan <quic_varada@...cinc.com>
> ---

Applied patch 1, thank

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