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Message-ID: <CAJhJPsX1k1L3yWt0k2P+_fNuUFipeYTSnyMdGvTdpviForbbwQ@mail.gmail.com>
Date: Mon, 21 Aug 2023 21:27:27 +0800
From: Keguang Zhang <keguang.zhang@...il.com>
To: Simon Horman <horms@...nel.org>
Cc: netdev@...r.kernel.org, devicetree@...r.kernel.org,
linux-mips@...r.kernel.org, linux-kernel@...r.kernel.org,
Lee Jones <lee@...nel.org>, Rob Herring <robh+dt@...nel.org>,
Krzysztof Kozlowski <krzysztof.kozlowski+dt@...aro.org>,
Conor Dooley <conor+dt@...nel.org>,
"David S . Miller" <davem@...emloft.net>,
Eric Dumazet <edumazet@...gle.com>,
Jakub Kicinski <kuba@...nel.org>,
Paolo Abeni <pabeni@...hat.com>,
Thomas Bogendoerfer <tsbogend@...ha.franken.de>,
Giuseppe Cavallaro <peppe.cavallaro@...com>,
Alexandre Torgue <alexandre.torgue@...s.st.com>,
Jose Abreu <joabreu@...opsys.com>,
Serge Semin <Sergey.Semin@...kalelectronics.ru>
Subject: Re: [PATCH v2 3/4] net: stmmac: Add glue layer for Loongson-1 SoC
On Sun, Aug 20, 2023 at 3:05 AM Simon Horman <horms@...nel.org> wrote:
>
> On Wed, Aug 16, 2023 at 07:13:09PM +0800, Keguang Zhang wrote:
> > This glue driver is created based on the arch-code
> > implemented earlier with the platform-specific settings.
> >
> > Use syscon for SYSCON register access.
> >
> > Partialy based on the previous work by Serge Semin.
>
> Hi Keguang Zhang,
>
> as it looks like there will be a v3 for other reasons,
> a minor nit from my side: Partialy -> Partially
>
Will do.
Thanks!
> ...
--
Best regards,
Keguang Zhang
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