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Message-ID: <065636fa-e6ac-4fcb-5d78-b3f281ac4609@linaro.org>
Date: Thu, 28 Sep 2023 09:10:26 +0200
From: Daniel Lezcano <daniel.lezcano@...aro.org>
To: "Rafael J. Wysocki" <rjw@...ysocki.net>,
Linux PM <linux-pm@...r.kernel.org>
Cc: LKML <linux-kernel@...r.kernel.org>,
Linux ACPI <linux-acpi@...r.kernel.org>,
Srinivas Pandruvada <srinivas.pandruvada@...ux.intel.com>,
Zhang Rui <rui.zhang@...el.com>,
Lukasz Luba <lukasz.luba@....com>,
"Rafael J. Wysocki" <rafael@...nel.org>
Subject: Re: [PATCH v1 10/13] thermal: core: Allow trip pointers to be used
for cooling device binding
On 21/09/2023 20:01, Rafael J. Wysocki wrote:
> From: Rafael J. Wysocki <rafael.j.wysocki@...el.com>
>
> Add new helper functions, thermal_bind_cdev_to_trip() and
> thermal_unbind_cdev_from_trip(), to allow a trip pointer to be used for
> binding a cooling device to a trip point and unbinding it, respectively,
> and redefine the existing helpers, thermal_zone_bind_cooling_device()
> and thermal_zone_unbind_cooling_device(), as wrappers around the new
> ones, respectively.
>
> No intentional functional impact.
>
> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@...el.com>
> ---
Reviewed-by: Daniel Lezcano <daniel.lezcano@...aro.org>
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