linux-kernel - [PATCH 0/4] Add Fairphone 5 thermals (PMK7325, PM7250B, PM7325)

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Message-Id: <20231013-fp5-thermals-v1-0-f14df01922e6@fairphone.com>
Date:   Fri, 13 Oct 2023 10:09:52 +0200
From:   Luca Weiss <luca.weiss@...rphone.com>
To:     Andy Gross <agross@...nel.org>,
        Bjorn Andersson <andersson@...nel.org>,
        Konrad Dybcio <konrad.dybcio@...aro.org>,
        Jonathan Cameron <jic23@...nel.org>,
        Lars-Peter Clausen <lars@...afoo.de>,
        Rob Herring <robh+dt@...nel.org>,
        Krzysztof Kozlowski <krzysztof.kozlowski+dt@...aro.org>,
        Conor Dooley <conor+dt@...nel.org>
Cc:     ~postmarketos/upstreaming@...ts.sr.ht, phone-devel@...r.kernel.org,
        linux-kernel@...r.kernel.org, linux-arm-msm@...r.kernel.org,
        linux-iio@...r.kernel.org, devicetree@...r.kernel.org,
        Luca Weiss <luca.weiss@...rphone.com>
Subject: [PATCH 0/4] Add Fairphone 5 thermals (PMK7325, PM7250B, PM7325)

Configure the necessary components to register some thermal zones in
Linux for the different thermistors found on the Fairphone 5.

The names for the thermal zones and ADCs were taken from the downstream
kernel but double checked against hardware schematics.

Signed-off-by: Luca Weiss <luca.weiss@...rphone.com>
---
Luca Weiss (4):
      iio: adc: Add PM7325 PMIC7 ADC bindings
      arm64: dts: qcom: qcm6490-fairphone-fp5: Add PM7250B thermals
      arm64: dts: qcom: qcm6490-fairphone-fp5: Add PMK7325 thermals
      arm64: dts: qcom: qcm6490-fairphone-fp5: Add PM7325 thermals

 arch/arm64/boot/dts/qcom/qcm6490-fairphone-fp5.dts | 221 +++++++++++++++++++++
 include/dt-bindings/iio/qcom,spmi-adc7-pm7325.h    |  69 +++++++
 2 files changed, 290 insertions(+)
---
base-commit: 7c0d0c1272e82888aa01017818d00245d452b895
change-id: 20231013-fp5-thermals-2b318c859dd4

Best regards,
-- 
Luca Weiss <luca.weiss@...rphone.com>