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Message-ID: <20231017210209.GU3553829@hu-bjorande-lv.qualcomm.com>
Date:   Tue, 17 Oct 2023 14:02:09 -0700
From:   Bjorn Andersson <quic_bjorande@...cinc.com>
To:     Rob Herring <robh@...nel.org>
CC:     Bjorn Andersson <andersson@...nel.org>,
        Konrad Dybcio <konrad.dybcio@...aro.org>,
        Greg Kroah-Hartman <gregkh@...uxfoundation.org>,
        Krzysztof Kozlowski <krzysztof.kozlowski+dt@...aro.org>,
        Conor Dooley <conor+dt@...nel.org>,
        Wesley Cheng <quic_wcheng@...cinc.com>,
        Thinh Nguyen <Thinh.Nguyen@...opsys.com>,
        Felipe Balbi <balbi@...nel.org>,
        Philipp Zabel <p.zabel@...gutronix.de>,
        <linux-arm-msm@...r.kernel.org>, <linux-usb@...r.kernel.org>,
        <devicetree@...r.kernel.org>, <linux-kernel@...r.kernel.org>,
        Johan Hovold <johan@...nel.org>,
        "Krishna Kurapati PSSNV" <quic_kriskura@...cinc.com>
Subject: Re: [PATCH 10/12] dt-bindings: usb: qcom,dwc3: Introduce flattened
 qcom,dwc3 binding

On Tue, Oct 17, 2023 at 01:31:36PM -0500, Rob Herring wrote:
> On Mon, Oct 16, 2023 at 08:11:18PM -0700, Bjorn Andersson wrote:
> > diff --git a/Documentation/devicetree/bindings/usb/qcom,dwc3.yaml b/Documentation/devicetree/bindings/usb/qcom,dwc3.yaml
[..]
> > +  reg:
> > +    description: Offset and length of register set for QSCRATCH wrapper
> > +    maxItems: 1
> 
> Isn't this more things now? Or the description is wrong.
> 

The description is wrong, the single cell is now intended to cover the
whole USB block, which spans XHCI, DWC3 and Qualcomm glue parts.

Regards,
Bjorn

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