linux-kernel - Re: [PATCH 09/12] dt-bindings: usb: qcom,dwc3: Rename to "glue"

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Message-ID: <42a05ea3-4693-498a-bc39-9ff50477e4ba@linaro.org>
Date:   Tue, 17 Oct 2023 08:05:00 +0200
From:   Krzysztof Kozlowski <krzysztof.kozlowski@...aro.org>
To:     Bjorn Andersson <quic_bjorande@...cinc.com>,
        Bjorn Andersson <andersson@...nel.org>,
        Konrad Dybcio <konrad.dybcio@...aro.org>,
        Greg Kroah-Hartman <gregkh@...uxfoundation.org>,
        Rob Herring <robh+dt@...nel.org>,
        Krzysztof Kozlowski <krzysztof.kozlowski+dt@...aro.org>,
        Conor Dooley <conor+dt@...nel.org>,
        Wesley Cheng <quic_wcheng@...cinc.com>,
        Thinh Nguyen <Thinh.Nguyen@...opsys.com>,
        Felipe Balbi <balbi@...nel.org>,
        Philipp Zabel <p.zabel@...gutronix.de>
Cc:     linux-arm-msm@...r.kernel.org, linux-usb@...r.kernel.org,
        devicetree@...r.kernel.org, linux-kernel@...r.kernel.org,
        Johan Hovold <johan@...nel.org>,
        Krishna Kurapati PSSNV <quic_kriskura@...cinc.com>
Subject: Re: [PATCH 09/12] dt-bindings: usb: qcom,dwc3: Rename to "glue"

On 17/10/2023 05:11, Bjorn Andersson wrote:
> The Qualcomm USB block consists of three intertwined parts, the XHCI,
> the DWC3 core and the Qualcomm DWC3 glue. The exsting binding represents
> the Qualcomm glue part, with the other two represented as in a child
> node.
> 
> Rename the qcom,dwc3 binding, to represent that this is indeed only the
> glue part, to make room for a combined binding.
> 
> The large "select" is included to avoid the schema to be selected for
> validation with the upcoming flattened binding - which includes
> snps,dwc3 in the compatible.
> 
> Signed-off-by: Bjorn Andersson <quic_bjorande@...cinc.com>
> ---

Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@...aro.org>

Best regards,
Krzysztof