linux-kernel - [PATCH v3 3/5] soc: hisilicon: kunpeng

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Message-ID: <20231201034534.7276-4-lihuisong@huawei.com>
Date:   Fri, 1 Dec 2023 11:45:32 +0800
From:   Huisong Li <lihuisong@...wei.com>
To:     <xuwei5@...ilicon.com>
CC:     <linux-kernel@...r.kernel.org>, <soc@...nel.org>,
        <linux-arm-kernel@...ts.infradead.org>,
        <Jonathan.Cameron@...wei.com>, <arnd@...db.de>, <krzk@...nel.org>,
        <sudeep.holla@....com>, <liuyonglong@...wei.com>,
        <lihuisong@...wei.com>
Subject: [PATCH v3 3/5] soc: hisilicon: kunpeng_hccs: Remove an unused blank line

Remove an unused blank line.

Signed-off-by: Huisong Li <lihuisong@...wei.com>
Reviewed-by: Jonathan Cameron <Jonathan.Cameron@...wei.com>
---
 drivers/soc/hisilicon/kunpeng_hccs.c | 1 -
 1 file changed, 1 deletion(-)

diff --git a/drivers/soc/hisilicon/kunpeng_hccs.c b/drivers/soc/hisilicon/kunpeng_hccs.c
index fd3ca0eb8175..15125f1e0f3e 100644
--- a/drivers/soc/hisilicon/kunpeng_hccs.c
+++ b/drivers/soc/hisilicon/kunpeng_hccs.c
@@ -529,7 +529,6 @@ static int hccs_get_all_port_info_on_die(struct hccs_dev *hdev,
 
 static int hccs_query_all_port_info_on_platform(struct hccs_dev *hdev)
 {
-
 	struct device *dev = hdev->dev;
 	struct hccs_chip_info *chip;
 	struct hccs_die_info *die;
-- 
2.33.0