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Message-ID: <CABjd4Ywx4-3BN7tF=Lv6LNTry_+j=jjM_v7SdzLaWHbuePip3g@mail.gmail.com>
Date: Wed, 31 Jan 2024 13:56:02 +0400
From: Alexey Charkov <alchark@...il.com>
To: Dragan Simic <dsimic@...jaro.org>
Cc: Rob Herring <robh+dt@...nel.org>,
Krzysztof Kozlowski <krzysztof.kozlowski+dt@...aro.org>, Conor Dooley <conor+dt@...nel.org>,
Heiko Stuebner <heiko@...ech.de>, Daniel Lezcano <daniel.lezcano@...aro.org>,
Viresh Kumar <viresh.kumar@...aro.org>, devicetree@...r.kernel.org,
linux-arm-kernel@...ts.infradead.org, linux-rockchip@...ts.infradead.org,
linux-kernel@...r.kernel.org
Subject: Re: [PATCH v2 1/4] arm64: dts: rockchip: enable built-in thermal
monitoring on rk3588
On Wed, Jan 31, 2024 at 9:05 AM Dragan Simic <dsimic@...jaro.org> wrote:
>
> Hello Alexey,
>
> Some small nitpicks below, please have a look.
>
> On 2024-01-30 19:21, Alexey Charkov wrote:
> > Include thermal zones information in device tree for rk3588 variants
>
> Please use "RK3588" instead of "rk3588", both here and in the
> patch subject. Looks much better.
Noted, thanks!
> > Signed-off-by: Alexey Charkov <alchark@...il.com>
> > ---
> > arch/arm64/boot/dts/rockchip/rk3588s.dtsi | 162
> > ++++++++++++++++++++++++++++++
> > 1 file changed, 162 insertions(+)
> >
> > diff --git a/arch/arm64/boot/dts/rockchip/rk3588s.dtsi
> > b/arch/arm64/boot/dts/rockchip/rk3588s.dtsi
> > index 36b1b7acfe6a..696cb72d75d0 100644
> > --- a/arch/arm64/boot/dts/rockchip/rk3588s.dtsi
> > +++ b/arch/arm64/boot/dts/rockchip/rk3588s.dtsi
> > @@ -10,6 +10,7 @@
> > #include <dt-bindings/reset/rockchip,rk3588-cru.h>
> > #include <dt-bindings/phy/phy.h>
> > #include <dt-bindings/ata/ahci.h>
> > +#include <dt-bindings/thermal/thermal.h>
> >
> > / {
> > compatible = "rockchip,rk3588";
> > @@ -2228,6 +2229,167 @@ tsadc: tsadc@...00000 {
> > status = "disabled";
> > };
> >
> > + thermal_zones: thermal-zones {
> > + /* sensor near the center of the whole chip */
>
> It would be good to replace "whole chip" with "SoC". Simpler and
> IIRC closer to the official description of the sensor.
The TRM only says "near chip center" (sic) :)
> > + package_thermal: package-thermal {
> > + polling-delay-passive = <0>;
> > + polling-delay = <0>;
> > + thermal-sensors = <&tsadc 0>;
> > +
> > + trips {
> > + package_crit: package-crit {
> > + temperature = <115000>;
> > + hysteresis = <0>;
> > + type = "critical";
> > + };
> > + };
> > + };
> > +
> > + /* sensor between A76 cores 0 and 1 */
> > + bigcore0_thermal: bigcore0-thermal {
> > + polling-delay-passive = <100>;
> > + polling-delay = <0>;
> > + thermal-sensors = <&tsadc 1>;
> > +
> > + trips {
>
> Please add the following comment here, to make it clear what's
> the purpose of this thermal trip when the IPA thermal governor
> is used (more similar comments below):
>
> /* IPA threshold */
Not so sure about this one: shouldn't the device tree be
implementation agnostic, and just describe the hardware and its
expectations? Sounds like references to a particular thermal governor
would be out of scope.
Best regards,
Alexey
> > + bigcore0_alert0: bigcore0-alert0 {
> > + temperature = <75000>;
> > + hysteresis = <2000>;
> > + type = "passive";
> > + };
>
> Please add the following comment here:
>
> /* IPA target */
>
> > + bigcore0_alert1: bigcore0-alert1 {
> > + temperature = <85000>;
> > + hysteresis = <2000>;
> > + type = "passive";
> > + };
> > + bigcore0_crit: bigcore0-crit {
> > + temperature = <115000>;
> > + hysteresis = <0>;
> > + type = "critical";
> > + };
> > + };
> > + cooling-maps {
> > + map0 {
> > + trip = <&bigcore0_alert1>;
> > + cooling-device =
> > + <&cpu_b0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>,
> > + <&cpu_b1 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
> > + };
> > + };
> > + };
> > +
> > + /* sensor between A76 cores 2 and 3 */
> > + bigcore2_thermal: bigcore2-thermal {
> > + polling-delay-passive = <100>;
> > + polling-delay = <0>;
> > + thermal-sensors = <&tsadc 2>;
> > +
> > + trips {
>
> Please add the following comment here:
>
> /* IPA threshold */
>
> > + bigcore2_alert0: bigcore2-alert0 {
> > + temperature = <75000>;
> > + hysteresis = <2000>;
> > + type = "passive";
> > + };
>
> Please add the following comment here:
>
> /* IPA target */
>
> > + bigcore2_alert1: bigcore2-alert1 {
> > + temperature = <85000>;
> > + hysteresis = <2000>;
> > + type = "passive";
> > + };
> > + bigcore2_crit: bigcore2-crit {
> > + temperature = <115000>;
> > + hysteresis = <0>;
> > + type = "critical";
> > + };
> > + };
> > + cooling-maps {
> > + map0 {
> > + trip = <&bigcore2_alert1>;
> > + cooling-device =
> > + <&cpu_b2 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>,
> > + <&cpu_b3 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
> > + };
> > + };
> > + };
> > +
> > + /* sensor between the four A55 cores */
> > + little_core_thermal: littlecore-thermal {
> > + polling-delay-passive = <100>;
> > + polling-delay = <0>;
> > + thermal-sensors = <&tsadc 3>;
> > +
> > + trips {
>
> Please add the following comment here:
>
> /* IPA threshold */
>
> > + littlecore_alert0: littlecore-alert0 {
> > + temperature = <75000>;
> > + hysteresis = <2000>;
> > + type = "passive";
> > + };
>
> Please add the following comment here:
>
> /* IPA target */
>
> > + littlecore_alert1: littlecore-alert1 {
> > + temperature = <85000>;
> > + hysteresis = <2000>;
> > + type = "passive";
> > + };
> > + littlecore_crit: littlecore-crit {
> > + temperature = <115000>;
> > + hysteresis = <0>;
> > + type = "critical";
> > + };
> > + };
> > + cooling-maps {
> > + map0 {
> > + trip = <&littlecore_alert1>;
> > + cooling-device =
> > + <&cpu_l0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>,
> > + <&cpu_l1 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>,
> > + <&cpu_l2 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>,
> > + <&cpu_l3 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
> > + };
> > + };
> > + };
> > +
> > + /* sensor near the PD_CENTER power domain */
> > + center_thermal: center-thermal {
> > + polling-delay-passive = <0>;
> > + polling-delay = <0>;
> > + thermal-sensors = <&tsadc 4>;
> > +
> > + trips {
> > + center_crit: center-crit {
> > + temperature = <115000>;
> > + hysteresis = <0>;
> > + type = "critical";
> > + };
> > + };
> > + };
> > +
> > + gpu_thermal: gpu-thermal {
> > + polling-delay-passive = <0>;
> > + polling-delay = <0>;
> > + thermal-sensors = <&tsadc 5>;
> > +
> > + trips {
> > + gpu_crit: gpu-crit {
> > + temperature = <115000>;
> > + hysteresis = <0>;
> > + type = "critical";
> > + };
> > + };
> > + };
> > +
> > + npu_thermal: npu-thermal {
> > + polling-delay-passive = <0>;
> > + polling-delay = <0>;
> > + thermal-sensors = <&tsadc 6>;
> > +
> > + trips {
> > + npu_crit: npu-crit {
> > + temperature = <115000>;
> > + hysteresis = <0>;
> > + type = "critical";
> > + };
> > + };
> > + };
> > + };
> > +
> > saradc: adc@...10000 {
> > compatible = "rockchip,rk3588-saradc";
> > reg = <0x0 0xfec10000 0x0 0x10000>;
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