linux-kernel - Re: [PATCH v2] usb: dwc3: qcom: Remove ACPI support from glue driver

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Message-ID: <Zebqt6ohrAz2eVVs@hovoldconsulting.com>
Date: Tue, 5 Mar 2024 10:49:43 +0100
From: Johan Hovold <johan@...nel.org>
To: Krishna Kurapati <quic_kriskura@...cinc.com>
Cc: Bjorn Andersson <andersson@...nel.org>,
	Wesley Cheng <quic_wcheng@...cinc.com>,
	Konrad Dybcio <konrad.dybcio@...aro.org>,
	Greg Kroah-Hartman <gregkh@...uxfoundation.org>,
	Thinh Nguyen <Thinh.Nguyen@...opsys.com>,
	linux-arm-msm@...r.kernel.org, linux-usb@...r.kernel.org,
	linux-kernel@...r.kernel.org, quic_ppratap@...cinc.com,
	quic_jackp@...cinc.com
Subject: Re: [PATCH v2] usb: dwc3: qcom: Remove ACPI support from glue driver

On Tue, Mar 05, 2024 at 03:02:16PM +0530, Krishna Kurapati wrote:
> Minimal ACPI support was added to the Qualcomm DWC3 glue driver in order to
> enable USB on SDM850 and SC8180X compute platforms. The support is still
> functional, but unnoticed regressions in other drivers indicates that no
> one actually booting any of platforms dependent on this implementation.
> 
> The functionality provides is the bare minimum and is not expected to aid
> in the effort of bringing full ACPI support to the driver in the future.
> 
> Remove the ACPI code from the Qualcomm DWC3 glue driver to aid in the
> implementation of improvements that are actually used like multiport and
> flattening device tree.
> 
> Commit message by Bjorn Andersson.
> 
> Signed-off-by: Krishna Kurapati <quic_kriskura@...cinc.com>
> ---
> Changes in v2:
> Removed ACPI dependency in Kconfig.

Reviewed-by: Johan Hovold <johan+linaro@...nel.org>