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Date: Thu, 21 Mar 2024 08:41:34 +0100
From: Krzysztof Kozlowski <krzysztof.kozlowski@...aro.org>
To: Raphael Gallais-Pou <rgallaispou@...il.com>,
 "Rafael J. Wysocki" <rafael@...nel.org>,
 Daniel Lezcano <daniel.lezcano@...aro.org>, Zhang Rui <rui.zhang@...el.com>,
 Lukasz Luba <lukasz.luba@....com>, Rob Herring <robh+dt@...nel.org>,
 Krzysztof Kozlowski <krzysztof.kozlowski+dt@...aro.org>,
 Conor Dooley <conor+dt@...nel.org>,
 Patrice Chotard <patrice.chotard@...s.st.com>, Lee Jones <lee@...nel.org>
Cc: linux-pm@...r.kernel.org, devicetree@...r.kernel.org,
 linux-kernel@...r.kernel.org, linux-arm-kernel@...ts.infradead.org
Subject: Re: [PATCH v3 1/2] dt-bindings: thermal: convert st,stih407-thermal
 to DT schema

On 20/03/2024 22:33, Raphael Gallais-Pou wrote:
> 'st,passive_colling_temp' does not appear in the device-tree, 'reg' and
> '#thermal-sensor-cells' are also missing in the device description.
> 
> Convert st,stih407-thermal binding to DT schema format in order to clean
> unused 'st,passive_cooling_temp' and add missing properties.
> 
> Signed-off-by: Raphael Gallais-Pou <rgallaispou@...il.com>
> ---
> Changes in v3:
>   - Specify const value for '#thermal-sensor-cells'
>   - Add 'maxItems' for 'interrupts' property
>   - Change commit log accordingly


Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@...aro.org>

Best regards,
Krzysztof


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