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Date: Fri, 14 Jun 2024 20:51:51 +0200
From: Javier Carrasco <javier.carrasco.cruz@...il.com>
To: Krzysztof Kozlowski <krzk@...nel.org>,
 Abdulrasaq Lawani <abdulrasaqolawani@...il.com>, rafael@...nel.org,
 daniel.lezcano@...aro.org, rui.zhang@...el.com, lukasz.luba@....com,
 robh@...nel.org, krzk+dt@...nel.org, conor+dt@...nel.org
Cc: linux-pm@...r.kernel.org, devicetree@...r.kernel.org,
 linux-kernel@...r.kernel.org, skhan@...uxfoundation.org
Subject: Re: [PATCH] dt-bindings: thermal: convert hisilicon-thermal.txt to
 dt-schema

On 14/06/2024 10:49, Krzysztof Kozlowski wrote:
> On 14/06/2024 00:42, Abdulrasaq Lawani wrote:
>> Convert the hisilicon SoCs tsensor txt bindings to dt-schema
>>
>> Signed-off-by: Abdulrasaq Lawani <abdulrasaqolawani@...il.com>
>> ---
>> Validated with dtschema and tested against `hi3660-hikey960.dts`
>>
> 
>> +     compatible = "hisilicon,tsensor";
>> +     reg = <0x0 0xf7030700 0x0 0x1000>;
> 
> Oh man...  get this past your mentors first.
> 
> 1. Messed indentation.
> 2. 0, unit address looks unnecessary.
> 

Sorry Krzysztof, it seems that this conversion went "live" without a
preliminary review by the mentors. We will make sure that the first step
is not omitted for v2.

Best regards,
Javier Carrasco

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