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Message-ID: <20240617-latter-recovery-b7ef60fdf9f8@spud>
Date: Mon, 17 Jun 2024 16:12:14 +0100
From: Conor Dooley <conor@...nel.org>
To: Abdulrasaq Lawani <abdulrasaqolawani@...il.com>
Cc: "Rafael J. Wysocki" <rafael@...nel.org>,
Daniel Lezcano <daniel.lezcano@...aro.org>,
Zhang Rui <rui.zhang@...el.com>, Lukasz Luba <lukasz.luba@....com>,
Rob Herring <robh@...nel.org>,
Krzysztof Kozlowski <krzk+dt@...nel.org>,
Conor Dooley <conor+dt@...nel.org>, skhan@...uxfoundation.org,
javier.carrasco.cruz@...il.com, linux-pm@...r.kernel.org,
devicetree@...r.kernel.org, linux-kernel@...r.kernel.org
Subject: Re: [PATCH v2] dt-bindings: thermal: convert hisilicon-thermal.txt
to dt-schema
On Mon, Jun 17, 2024 at 10:20:52AM -0400, Abdulrasaq Lawani wrote:
> Convert the hisilicon SoCs tsensor txt bindings to dt-schema
>
> Signed-off-by: Abdulrasaq Lawani <abdulrasaqolawani@...il.com>
> ---
> Changes in v2:
> - Remove extra node in example.
> - Use standard node name in example.
> - Include additional defines from includes.
> - Add reference to thermal-sensor.yaml.
> - Remove redundant properties and comments.
>
> - Link to v1: https://lore.kernel.org/all/20240613224204.185844-1-abdulrasaqolawani@gmail.com
Why did I get sent a v2 of this 3 minutes after I got sent the v3?
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