linux-kernel - Re: [PATCH v2 0/2] More thermal configuration for Fairphone 4

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Message-ID: <172030328809.28909.15694647738799552654.b4-ty@kernel.org>
Date: Sat,  6 Jul 2024 17:01:23 -0500
From: Bjorn Andersson <andersson@...nel.org>
To: Konrad Dybcio <konrad.dybcio@...aro.org>,
	Rob Herring <robh@...nel.org>,
	Krzysztof Kozlowski <krzk+dt@...nel.org>,
	Conor Dooley <conor+dt@...nel.org>,
	AngeloGioacchino Del Regno <angelogioacchino.delregno@...labora.com>,
	Luca Weiss <luca.weiss@...rphone.com>
Cc: ~postmarketos/upstreaming@...ts.sr.ht,
	phone-devel@...r.kernel.org,
	linux-arm-msm@...r.kernel.org,
	devicetree@...r.kernel.org,
	linux-kernel@...r.kernel.org
Subject: Re: [PATCH v2 0/2] More thermal configuration for Fairphone 4


On Fri, 05 Jul 2024 14:40:08 +0200, Luca Weiss wrote:
> Add the thermal configuration for the thermistors connected to PMK8003
> and PM6150L. With that all the external thermistors on the phone should
> be present in the dts.
> 
> 

Applied, thanks!

[1/2] arm64: dts: qcom: sm7225-fairphone-fp4: Add PMK8003 thermals
      commit: 4d37847187b3fd7ff1fac23248a8ec11d89b3e55
[2/2] arm64: dts: qcom: sm7225-fairphone-fp4: Add PM6150L thermals
      commit: 8cf636a03260352853ff1c949f30c418600e7b2b

Best regards,
-- 
Bjorn Andersson <andersson@...nel.org>