linux-kernel - [PATCH v2] dt-bindings: thermal: qcom-tsens: document the QCS9100 Temperature Sensor

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Message-ID: <20240709-document_qcs9100_tsens_compatible-v2-1-f09a143161c1@quicinc.com>
Date: Tue, 9 Jul 2024 21:28:02 +0800
From: Tengfei Fan <quic_tengfan@...cinc.com>
To: Amit Kucheria <amitk@...nel.org>,
        Thara Gopinath
	<thara.gopinath@...il.com>,
        "Rafael J. Wysocki" <rafael@...nel.org>,
        "Daniel
 Lezcano" <daniel.lezcano@...aro.org>,
        Zhang Rui <rui.zhang@...el.com>, "Lukasz Luba" <lukasz.luba@....com>,
        Rob Herring <robh@...nel.org>,
        "Krzysztof Kozlowski" <krzk+dt@...nel.org>,
        Conor Dooley
	<conor+dt@...nel.org>
CC: <kernel@...cinc.com>, <linux-pm@...r.kernel.org>,
        <linux-arm-msm@...r.kernel.org>, <devicetree@...r.kernel.org>,
        <linux-kernel@...r.kernel.org>, Tengfei Fan <quic_tengfan@...cinc.com>
Subject: [PATCH v2] dt-bindings: thermal: qcom-tsens: document the QCS9100
 Temperature Sensor

Document the Temperature Sensor (TSENS) on the QCS9100 Platform.
QCS9100 is drived from SA8775p. Currently, both the QCS9100 and SA8775p
platform use non-SCMI resource. In the future, the SA8775p platform will
move to use SCMI resources and it will have new sa8775p-related device
tree. Consequently, introduce "qcom,qcs9100-tsens" to describe non-SCMI
based tsens.

Signed-off-by: Tengfei Fan <quic_tengfan@...cinc.com>
---
Introduce support for the QCS9100 SoC device tree (DTSI) and the
QCS9100 RIDE board DTS. The QCS9100 is a variant of the SA8775p.
While the QCS9100 platform is still in the early design stage, the
QCS9100 RIDE board is identical to the SA8775p RIDE board, except it
mounts the QCS9100 SoC instead of the SA8775p SoC.

The QCS9100 SoC DTSI is directly renamed from the SA8775p SoC DTSI, and
all the compatible strings will be updated from "SA8775p" to "QCS9100".
The QCS9100 device tree patches will be pushed after all the device tree
bindings and device driver patches are reviewed.

The final dtsi will like:
https://lore.kernel.org/linux-arm-msm/20240703025850.2172008-3-quic_tengfan@quicinc.com/

The detailed cover letter reference:
https://lore.kernel.org/linux-arm-msm/20240703025850.2172008-1-quic_tengfan@quicinc.com/
---
Changes in v2:
  - Split huge patch series into different patch series according to
    subsytems
  - Update patch commit message

prevous disscussion here:
[1] v1: https://lore.kernel.org/linux-arm-msm/20240703025850.2172008-1-quic_tengfan@quicinc.com/
---
 Documentation/devicetree/bindings/thermal/qcom-tsens.yaml | 1 +
 1 file changed, 1 insertion(+)

diff --git a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
index 99d9c526c0b6..ace2cf1975c4 100644
--- a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
+++ b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
@@ -51,6 +51,7 @@ properties:
               - qcom,msm8996-tsens
               - qcom,msm8998-tsens
               - qcom,qcm2290-tsens
+              - qcom,qcs9100-tsens
               - qcom,sa8775p-tsens
               - qcom,sc7180-tsens
               - qcom,sc7280-tsens

---
base-commit: 0b58e108042b0ed28a71cd7edf5175999955b233
change-id: 20240709-document_qcs9100_tsens_compatible-b07b57d9b4dc

Best regards,
-- 
Tengfei Fan <quic_tengfan@...cinc.com>