linux-kernel - Re: [PATCH 3/3] arm64: dts: layerscape: move dwc3 usb under glue layer node

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Message-ID: <20240807004105.pea4z7oobw7n3qy6@synopsys.com>
Date: Wed, 7 Aug 2024 00:41:09 +0000
From: Thinh Nguyen <Thinh.Nguyen@...opsys.com>
To: Frank Li <Frank.li@....com>
CC: Rob Herring <robh@...nel.org>,
        Greg Kroah-Hartman <gregkh@...uxfoundation.org>,
        Krzysztof Kozlowski <krzk+dt@...nel.org>,
        Conor Dooley <conor+dt@...nel.org>,
        Thinh Nguyen <Thinh.Nguyen@...opsys.com>,
        Shawn Guo <shawnguo@...nel.org>,
        "linux-usb@...r.kernel.org" <linux-usb@...r.kernel.org>,
        "devicetree@...r.kernel.org" <devicetree@...r.kernel.org>,
        "linux-kernel@...r.kernel.org" <linux-kernel@...r.kernel.org>,
        "linux-arm-kernel@...ts.infradead.org" <linux-arm-kernel@...ts.infradead.org>,
        "imx@...ts.linux.dev" <imx@...ts.linux.dev>
Subject: Re: [PATCH 3/3] arm64: dts: layerscape: move dwc3 usb under glue
 layer node

Hi Frank,

On Tue, Jul 30, 2024, Frank Li wrote:
> On Thu, Jul 11, 2024 at 03:38:46PM -0600, Rob Herring wrote:
> > On Wed, Jul 10, 2024 at 07:02:24PM -0400, Frank Li wrote:
> > > New usb glue layer driver support enable dma-coherent. So put dwc3 usb node
> > > under glue layer node and enable dma-coherent.
> > > 
> > > Signed-off-by: Frank Li <Frank.Li@....com>
> > > ---
> > >  arch/arm64/boot/dts/freescale/fsl-ls1028a.dtsi | 43 ++++++++++++++++----------
> > >  1 file changed, 26 insertions(+), 17 deletions(-)
> > > 
> > > diff --git a/arch/arm64/boot/dts/freescale/fsl-ls1028a.dtsi b/arch/arm64/boot/dts/freescale/fsl-ls1028a.dtsi
> > > index 70b8731029c4e..24b937032480f 100644
> > > --- a/arch/arm64/boot/dts/freescale/fsl-ls1028a.dtsi
> > > +++ b/arch/arm64/boot/dts/freescale/fsl-ls1028a.dtsi
> > > @@ -615,24 +615,33 @@ gpio3: gpio@...0000 {
> > >  			little-endian;
> > >  		};
> > >  
> > > -		usb0: usb@...0000 {
> > > -			compatible = "fsl,ls1028a-dwc3", "snps,dwc3";
> > > -			reg = <0x0 0x3100000 0x0 0x10000>;
> > > -			interrupts = <GIC_SPI 80 IRQ_TYPE_LEVEL_HIGH>;
> > > -			snps,dis_rxdet_inp3_quirk;
> > > -			snps,quirk-frame-length-adjustment = <0x20>;
> > > -			snps,incr-burst-type-adjustment = <1>, <4>, <8>, <16>;
> > > -			status = "disabled";
> > > -		};
> > > +		usb {
> > > +			compatible = "fsl,ls1028a-dwc3";
> > > +			#address-cells = <2>;
> > > +			#size-cells = <2>;
> > > +			ranges;
> > 
> > No, the existing way is preferred unless you have actual glue/wrapper 
> > registers. Plus this breaks compatibility.
> 
> Actually, it has glue layer, such as wakeup controller. Remote wakeup have
> not implement at layerscape platform yet. But this register distribute to
> difference place with other module misc controller registers. It is
> difference for difference chips. I can think deep how to handle this. 
> 
> but anyways, it will break compatibility. I have not find good way to
> keep compatibility and add glue layer, such as wakeup support.
> 
> Frank
> 

Will this impact how the rest of the series look? If so, I'll wait until
you resolve this issue and review the rest.

BR,
Thinh