linux-kernel - Re: [PATCH v3 14/14] thermal: core: Clean up trip bind/unbind functions

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Message-ID: <8e279112-9b2b-1066-50f8-ba0b318b8e25@huawei.com>
Date: Wed, 21 Aug 2024 17:34:07 +0800
From: "lihuisong (C)" <lihuisong@...wei.com>
To: "Rafael J. Wysocki" <rjw@...ysocki.net>
CC: LKML <linux-kernel@...r.kernel.org>, Daniel Lezcano
	<daniel.lezcano@...aro.org>, Lukasz Luba <lukasz.luba@....com>, Zhang Rui
	<rui.zhang@...el.com>, Linux PM <linux-pm@...r.kernel.org>
Subject: Re: [PATCH v3 14/14] thermal: core: Clean up trip bind/unbind
 functions


在 2024/8/20 0:33, Rafael J. Wysocki 写道:
> From: Rafael J. Wysocki <rafael.j.wysocki@...el.com>
>
> Make thermal_bind_cdev_to_trip() take a struct cooling_spec pointer
> to reduce the number of its arguments, change the return type of
> thermal_unbind_cdev_from_trip() to void and rearrange the code in
> thermal_zone_cdev_binding() to reduce the indentation level.
>
> No intentional functional impact.
>
> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@...el.com>
> ---

Acked-by: Huisong Li <lihuisong@...wei.com>

>
>
>
> .