linux-kernel - Re: [PATCH v3 2/2] dt-bindings: mfd: Add properties for thermal sensor cells

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Message-ID: <1c1604b7-baf2-466d-a46c-4ed8d407ed9c@kernel.org>
Date: Mon, 25 Nov 2024 09:54:48 +0100
From: Krzysztof Kozlowski <krzk@...nel.org>
To: Guenter Roeck <linux@...ck-us.net>, "Sung-Chi, Li" <lschyi@...omium.org>
Cc: Conor Dooley <conor.dooley@...rochip.com>, Lee Jones <lee@...nel.org>,
 Rob Herring <robh@...nel.org>, Krzysztof Kozlowski <krzk+dt@...nel.org>,
 Conor Dooley <conor+dt@...nel.org>, Benson Leung <bleung@...omium.org>,
 Guenter Roeck <groeck@...omium.org>, Thomas Weißschuh
 <thomas@...ssschuh.net>, Jean Delvare <jdelvare@...e.com>,
 devicetree@...r.kernel.org, chrome-platform@...ts.linux.dev,
 linux-kernel@...r.kernel.org, linux-hwmon@...r.kernel.org
Subject: Re: [PATCH v3 2/2] dt-bindings: mfd: Add properties for thermal
 sensor cells

On 25/11/2024 09:52, Krzysztof Kozlowski wrote:
> On 13/11/2024 04:05, Guenter Roeck wrote:
>> On 11/12/24 18:39, Sung-Chi, Li wrote:
>>> The cros_ec supports reading thermal values from thermal sensors
>>> connect to it. Add the property '#thermal-sensor-cells' bindings, such
>>> that thermal framework can recognize cros_ec as a valid thermal device.
>>>
>>> Signed-off-by: Sung-Chi, Li <lschyi@...omium.org>
>>> Acked-by: Conor Dooley <conor.dooley@...rochip.com>
>>> ---
>>>   Changes in v2:
>>>     - Add changes for DTS binding.
>>>   Changes in v3:
>>>     - Remove unneeded Change-Id tag in commit message.
>>> ---
>>
>> I can't apply this one (not in hwmon space), so
>>
>> Acked-by: Guenter Roeck <linux@...ck-us.net>
>>
>> with the assumption that Lee will pick it up.
> 
> This was merged, while I was AFK, so the ship has sailed, but let me
> state here objection for any future discussions:
> 
> NAK, this is not a thermal sensor. The commit msg explains what they
> want to achieve, but that's not a valid reason to add property from
> different class of devices.
> 
> This is some hardware/temperature monitoring device or power supply, not
> part of SoC, not integrated into any SoC thermal zone. Calling it
> thermal sensor is huge stretch and inappropriate hardware description
> leading to next patches like calling it a SoC cooling device, instead of
> simple power supply (for which we have bindings!).
Ah, wait, this was not merged, so I can actually NAK it.

BTW, all your patches are incorrectly ordered - bindings are always
before the users. You cannot merge user of a binding without or before
the binding.

Best regards,
Krzysztof