linux-kernel - [V7 0/5] Add EPSS L3 provider support on SA8775P SoC

lists.openwall.net		lists / announce owl-users owl-dev john-users john-dev passwdqc-users yescrypt popa3d-users / oss-security kernel-hardening musl sabotage tlsify passwords / crypt-dev xvendor / Bugtraq Full-Disclosure linux-kernel linux-netdev linux-ext4 linux-hardening linux-cve-announce PHC
Open Source and information security mailing list archives

Hash Suite: Windows password security audit tool. GUI, reports in PDF.

[<prev] [next>] [thread-next>] [day] [month] [year] [list]

Message-ID: <20250111161429.51-1-quic_rlaggysh@quicinc.com>
Date: Sat, 11 Jan 2025 16:14:24 +0000
From: Raviteja Laggyshetty <quic_rlaggysh@...cinc.com>
To: Georgi Djakov <djakov@...nel.org>, Rob Herring <robh@...nel.org>,
        Krzysztof Kozlowski <krzk+dt@...nel.org>,
        Conor Dooley <conor+dt@...nel.org>,
        Bjorn Andersson <andersson@...nel.org>,
        Konrad Dybcio
	<konradybcio@...nel.org>,
        Odelu Kukatla <quic_okukatla@...cinc.com>,
        "Mike
 Tipton" <mdptipton@...cinc.com>,
        Vivek Aknurwar <viveka@...cinc.com>
CC: Sibi Sankar <quic_sibis@...cinc.com>, <linux-arm-msm@...r.kernel.org>,
        <linux-pm@...r.kernel.org>, <devicetree@...r.kernel.org>,
        <linux-kernel@...r.kernel.org>
Subject: [V7 0/5]  Add EPSS L3 provider support on SA8775P SoC

Add Epoch Subsystem (EPSS) L3 provider support on SA8775P SoCs.

Current interconnect framework is based on static IDs for creating node
and registering with framework. This becomes a limitation for topologies
where there are multiple instances of same interconnect provider. Add
icc_node_create_alloc_id() API to create icc node with dynamic id, this
will help to overcome the dependency on static IDs.

Change since v6:
 - Added icc_node_create_alloc_id() API to dynamically allocate ID while 
   creating the node. Replaced the IDA (ID allocator) with
   icc_node_create_alloc_id() API to allocate node IDs dynamically.
 - Removed qcom,epss-l3-perf generic compatible as per the comment.
 - Added L3 ICC handles for CPU0 and CPU4 in DT, as per Bjorn comment.
   Link to comment:
   https://lore.kernel.org/lkml/ww3t3tu7p36qzlhcetaxif2xzrpgslydmuqo3fqvisbuar4bjh@qc2u43dck3qi/

Change since v5:
 - Reused qcom,sm8250-epss-l3 compatible for sa8775p SoC.
 - Rearranged the patches, moved dt changes to end of series.
 - Updated the commit text.

Changes since v4:
 - Added generic compatible "qcom,epss-l3-perf" and split the driver
   changes accordingly.

Changes since v3:
 - Removed epss-l3-perf generic compatible changes. These will be posted
   as separate patch until then SoC specific compatible will be used for
   probing.

Changes since v2:
 - Updated the commit text to reflect the reason for code change.
 - Added SoC-specific and generic compatible to driver match table.

Changes since v1:
 - Removed the usage of static IDs and implemented dynamic ID assignment
   for icc nodes using IDA.
 - Removed separate compatibles for cl0 and cl1. Both cl0 and cl1
   devices use the same compatible.
 - Added new generic compatible for epss-l3-perf.

Jagadeesh Kona (1):
  arm64: dts: qcom: sa8775p: Add CPU OPP tables to scale DDR/L3

Raviteja Laggyshetty (4):
  interconnect: core: Add dynamic id allocation support
  interconnect: qcom: Add multidev EPSS L3 support
  dt-bindings: interconnect: Add EPSS L3 compatible for SA8775P
  arm64: dts: qcom: sa8775p: add EPSS l3 interconnect provider

 .../bindings/interconnect/qcom,osm-l3.yaml    |   1 +
 arch/arm64/boot/dts/qcom/sa8775p.dtsi         | 229 ++++++++++++++++++
 drivers/interconnect/core.c                   |  32 +++
 drivers/interconnect/qcom/osm-l3.c            |  91 +++++--
 include/linux/interconnect-provider.h         |   6 +
 5 files changed, 335 insertions(+), 24 deletions(-)

-- 
2.39.2