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Message-ID: <292ed7db-aa9a-4dd3-a887-70e0ccf346c2@oss.qualcomm.com>
Date: Sat, 1 Feb 2025 16:37:46 +0100
From: Konrad Dybcio <konrad.dybcio@....qualcomm.com>
To: neil.armstrong@...aro.org, Bjorn Andersson <andersson@...nel.org>,
Konrad Dybcio <konradybcio@...nel.org>, Rob Herring <robh@...nel.org>,
Krzysztof Kozlowski <krzk+dt@...nel.org>,
Conor Dooley <conor+dt@...nel.org>
Cc: linux-arm-msm@...r.kernel.org, devicetree@...r.kernel.org,
linux-kernel@...r.kernel.org
Subject: Re: [PATCH v3 2/2] arm64: dts: qcom: sm8650: setup gpu thermal with
higher temperatures
On 29.01.2025 3:41 PM, Neil Armstrong wrote:
> On 29/01/2025 10:43, Neil Armstrong wrote:
>> On the SM8650, the dynamic clock and voltage scaling (DCVS) for the GPU
>> is done from the HLOS, but the GPU can achieve a much higher temperature
>> before failing according the the reference downstream implementation.
>>
>> Set higher temperatures in the GPU trip points corresponding to
>> the temperatures provided by Qualcomm in the dowstream source, much
>> closer to the junction temperature and with a higher critical
>> temperature trip in the case the HLOS DCVS cannot handle the
>> temperature surge.
>
> Since the tsens MAX_THRESHOLD which leads to a system
> monitor thermal shutdown is set at 120C, I need to lower
> the critical and hot trip point, so please ignore this patchset.
Should we make the "critical" trip point something like 110 or so? If
LMH triggers a hard shutdown at 120, the OS will not have any time to
take action. And 120 sounds like we're pushing it quite hard anyway.
Konrad
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