linux-kernel - Re: [PATCH v3 0/2] mtd: spi-nor: winbond: Add support for flashes with several dies

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Message-ID: <mafs0a5b3je5z.fsf@kernel.org>
Date: Mon, 03 Feb 2025 14:28:24 +0000
From: Pratyush Yadav <pratyush@...nel.org>
To: Miquel Raynal <miquel.raynal@...tlin.com>
Cc: Tudor Ambarus <tudor.ambarus@...aro.org>,  Pratyush Yadav
 <pratyush@...nel.org>,  Michael Walle <mwalle@...nel.org>,  Richard
 Weinberger <richard@....at>,  Vignesh Raghavendra <vigneshr@...com>,
  Thomas Petazzoni <thomas.petazzoni@...tlin.com>,  Steam Lin
 <STLin2@...bond.com>,  linux-mtd@...ts.infradead.org,
  linux-kernel@...r.kernel.org
Subject: Re: [PATCH v3 0/2] mtd: spi-nor: winbond: Add support for flashes
 with several dies

On Fri, Jan 10 2025, Miquel Raynal wrote:

> Some Winbond devices are made of up smaller stacked dies, like for
> instance W25Q01JV which is a 1G-bit serial flash memory made of two
> 512M-bit dies, and W25Q02JV which is made of four of them. Internally,
> the dies can either be in the active state (only one at a time), the
> others being in the idle state. Problem: there are commands impacting
> all 4 dies, for which we monitor the state of the chip reading the
> status register, but the status register only gives the status of the
> active die. It was observed a possible internal deviation of up to 200us
> between each die when doing similar operations, which can lead to
> races. This series aims at supporting these chips properly.

Applied to spi-nor/next. Thanks!

-- 
Regards,
Pratyush Yadav