linux-kernel - RE: [RFC PATCH 0/3] thermal: Add CPU hotplug cooling driver

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Message-ID:
 <OSBPR01MB27751FB038A030EBCE0A93B2FFD12@OSBPR01MB2775.jpnprd01.prod.outlook.com>
Date: Tue, 11 Mar 2025 11:33:27 +0000
From: John Madieu <john.madieu.xa@...renesas.com>
To: Biju Das <biju.das.jz@...renesas.com>, "geert+renesas@...der.be"
	<geert+renesas@...der.be>, "niklas.soderlund+renesas@...natech.se"
	<niklas.soderlund+renesas@...natech.se>, "conor+dt@...nel.org"
	<conor+dt@...nel.org>, "krzk+dt@...nel.org" <krzk+dt@...nel.org>,
	"robh@...nel.org" <robh@...nel.org>, "rafael@...nel.org" <rafael@...nel.org>,
	"daniel.lezcano@...aro.org" <daniel.lezcano@...aro.org>
CC: "magnus.damm@...il.com" <magnus.damm@...il.com>, Claudiu Beznea
	<claudiu.beznea.uj@...renesas.com>, "devicetree@...r.kernel.org"
	<devicetree@...r.kernel.org>, "john.madieu@...il.com"
	<john.madieu@...il.com>, "rui.zhang@...el.com" <rui.zhang@...el.com>,
	"linux-kernel@...r.kernel.org" <linux-kernel@...r.kernel.org>,
	"linux-renesas-soc@...r.kernel.org" <linux-renesas-soc@...r.kernel.org>,
	"linux-pm@...r.kernel.org" <linux-pm@...r.kernel.org>
Subject: RE: [RFC PATCH 0/3] thermal: Add CPU hotplug cooling driver

Hi Biju,

Thanks for your review.

> -----Original Message-----
> From: Biju Das <biju.das.jz@...renesas.com>
> Sent: Monday, March 10, 2025 11:18 AM
> To: John Madieu <john.madieu.xa@...renesas.com>; geert+renesas@...der.be;
> niklas.soderlund+renesas@...natech.se; conor+dt@...nel.org;
> krzk+dt@...nel.org; robh@...nel.org; rafael@...nel.org;
> daniel.lezcano@...aro.org
> Subject: RE: [RFC PATCH 0/3] thermal: Add CPU hotplug cooling driver
> 
> Hi John,
> 
> Thanks for the patch.
> 
> > -----Original Message-----
> > From: John Madieu <john.madieu.xa@...renesas.com>
> > Sent: 09 March 2025 12:13
> > Subject: [RFC PATCH 0/3] thermal: Add CPU hotplug cooling driver
> >
> > MIME-Version: 1.0
> > Content-Type: text/plain; charset=UTF-8
> > Content-Transfer-Encoding: 8bit
> >
> > This patch series introduces a new thermal cooling driver that
> > implements CPU hotplug-based thermal management. The driver
> > dynamically takes CPUs offline during thermal excursions to reduce
> > power consumption and prevent overheating, while maintaining system
> stability by keeping at least one CPU online.
> >
> > 1- Problem Statement
> >
> > Modern SoCs require robust thermal management to prevent overheating
> > under heavy workloads. Existing cooling mechanisms like frequency
> > scaling may not always provide sufficient thermal relief, especially in
> multi-core systems where per-core thermal contributions can be
> significant.
> >
> > 2- Solution Overview
> >
> > The driver:
> >
> >  - Integrates with the Linux thermal framework as a cooling device
> >  - Registers per-CPU cooling devices that respond to thermal trip
> > points
> >  - Uses CPU hotplug operations to reduce thermal load
> >  - Maintains system stability by preserving the boot CPU from being
> > put offline,  regardless the CPUs that are specified in cooling device
> list.
> >  - Implements proper state tracking and cleanup
> >
> > Key Features:
> >
> >  - Dynamic CPU online/offline management based on thermal thresholds
> >  - Device tree-based configuration via thermal zones and trip points
> >  - Hysteresis support through thermal governor interactions
> >  - Safe handling of CPU state transitions during module load/unload
> >  - Compatibility with existing thermal management frameworks
> >
> > Testing
> >
> >  - Verified on Renesas RZ/G3E platforms with multi-core CPU
> > configurations
> >  - Validated thermal response using artificial load generation
> > (emul_temp)
> >  - Confirmed proper interaction with other cooling devices
> >  - Verified support for 'plug' type trace events
> >  - Tested with step_wise governor
> >
> > As the 'hot' type is already used for user space notification, I've
> choosen 'plug' for this new type.
> > suggestions on this are welcome. Here is an example of 'thermal-zone'
> that integrate 'plug' type:
> >
> > ```
> > thermal-zones {
> > 	cpu-thermal {
> > 		polling-delay = <1000>;
> > 		polling-delay-passive = <250>;
> > 		thermal-sensors = <&tsu>;
> >
> > 		cooling-maps {
> > 			map0 {
> > 				trip = <&target>;
> > 				cooling-device = <&cpu0 0 3>, <&cpu3 0 3>;
> > 				contribution = <1024>;
> > 			};
> 
> Is it not possible here to make cpu1 and cpu2 as well for DVFS passive
> cooling?

>From my tests, adding same CPUs as cooling devices in both maps
generated some warnings saying that the trip could not be bound
to my ("plug") cooling device.

This is a point I still must investigate, and comments from maintainers
would be welcome. However, despite these warnings, I had no unexpected
behavior, and even thermal trace events were Ok.

> 
> >
> > 			map1 {
> > 				trip = <&trip_emergency>;
> > 				cooling-device = <&cpu1 0 1>, <&cpu2 0 1>;
> > 				contribution = <1024>;
> > 			};
> >
> > 		};
> 
> Is it not possible here to make cpu3 as well as hot pluggable device for
> cooling?
> 
> Cheers,
> Biju

Regards,
John