lists.openwall.net   lists  /  announce  owl-users  owl-dev  john-users  john-dev  passwdqc-users  yescrypt  popa3d-users  /  oss-security  kernel-hardening  musl  sabotage  tlsify  passwords  /  crypt-dev  xvendor  /  Bugtraq  Full-Disclosure  linux-kernel  linux-netdev  linux-ext4  linux-hardening  linux-cve-announce  PHC 
Open Source and information security mailing list archives
 
Hash Suite: Windows password security audit tool. GUI, reports in PDF.
[<prev] [next>] [<thread-prev] [thread-next>] [day] [month] [year] [list]
Message-ID: <agbftnk7uqj6e2zyw3igxlp3cctl6xhk6ix4gp6u5dot7nf3fm@cipkx222ffo5>
Date: Wed, 23 Apr 2025 17:02:10 +0300
From: Dmitry Baryshkov <dmitry.baryshkov@....qualcomm.com>
To: Shazad Hussain <quic_shazhuss@...cinc.com>
Cc: Deepti Jaggi <quic_djaggi@...cinc.com>, andersson@...nel.org,
        konradybcio@...nel.org, robh@...nel.org, krzk+dt@...nel.org,
        conor+dt@...nel.org, quic_psodagud@...cinc.com,
        quic_ptalari@...cinc.com, linux-arm-msm@...r.kernel.org,
        devicetree@...r.kernel.org, linux-kernel@...r.kernel.org
Subject: Re: [PATCH v3] arm64: dts: qcom: add initial support for qcom
 sa8255p-ride

On Wed, Apr 23, 2025 at 10:16:57AM +0530, Shazad Hussain wrote:
> 
> 
> On 4/23/2025 4:42 AM, Deepti Jaggi wrote:
> > From: Nikunj Kela <quic_nkela@...cinc.com>
> > 
> > This adds basic support for the Qualcomm sa8255p platform and the
> > reference board: sa8255p-ride. The dt files describe the basics of the
> > SoC and enable booting to shell with ramdisk.
> > 
> > The Qualcomm automotive sa8255p SoC utilizes firmware to configure platform
> > resources such as clocks, interconnects, and TLMM. Device drivers request
> > these resources through the SCMI power and performance protocols. The SCMI
> > platform supports resource aggregation and handles parallel requests from
> > agents, with each driver having a dedicated SCMI channel for communication.
> > 
> > Co-developed-by: Shazad Hussain <quic_shazhuss@...cinc.com>
> > Signed-off-by: Shazad Hussain <quic_shazhuss@...cinc.com>
> > Signed-off-by: Nikunj Kela <quic_nkela@...cinc.com>
> > Signed-off-by: Deepti Jaggi <quic_djaggi@...cinc.com>
> > ---
> > This patch is dependent on [2] for booting to shell and DT bindings.
> > 
> > Changes in v3:
> >          Removed the patches from original series [1].
> >          Added arm,max-msg and arm,max-msg-size DT property in scmi nodes.
> >          Changed max-rx-timeout-ms to arm,max-rx-timeout-ms in scmi nodes.
> >          Updated commit text.
> >          Reordered range property for qupv3_id_0, qupv3_id_1 and qupv3_id_3 nodes.
> >          Reordered vendor property(#qcom,sensors) for tsens* nodes.
> >          Changed cache labels to lower case.
> >          Removed unused i2c,spi and tlmm nodes.
> >          Updated reserved memory nodes.
> > 
> > Changes in v2:
> >          Removed scmichannels label and alias
> >          Modified scmi node name to conform to schema
> >          Moved status property to be the last one in scmi instances
> >          Changed to lower case for cpu labels
> >          Added fallback compatible for tlmm node
> > 
> > [1]: https://lore.kernel.org/all/20240903220240.2594102-1-quic_nkela@quicinc.com/
> > [2]: https://lore.kernel.org/all/20250418151235.27787-1-quic_ptalari@quicinc.com/
> > ---
> >   arch/arm64/boot/dts/qcom/Makefile           |    1 +
> >   arch/arm64/boot/dts/qcom/sa8255p-pmics.dtsi |   80 +
> >   arch/arm64/boot/dts/qcom/sa8255p-ride.dts   |   94 +
> >   arch/arm64/boot/dts/qcom/sa8255p-scmi.dtsi  | 2440 +++++++++++++++++++
> >   arch/arm64/boot/dts/qcom/sa8255p.dtsi       | 2075 ++++++++++++++++
> >   5 files changed, 4690 insertions(+)
> >   create mode 100644 arch/arm64/boot/dts/qcom/sa8255p-pmics.dtsi
> >   create mode 100644 arch/arm64/boot/dts/qcom/sa8255p-ride.dts
> >   create mode 100644 arch/arm64/boot/dts/qcom/sa8255p-scmi.dtsi
> >   create mode 100644 arch/arm64/boot/dts/qcom/sa8255p.dtsi
> > 
> > diff --git a/arch/arm64/boot/dts/qcom/Makefile b/arch/arm64/boot/dts/qcom/Makefile
> > index adb4d026bcc4..7437e51e5849 100644
> > --- a/arch/arm64/boot/dts/qcom/Makefile
> > +++ b/arch/arm64/boot/dts/qcom/Makefile
> > @@ -134,6 +134,7 @@ qrb5165-rb5-vision-mezzanine-dtbs	:= qrb5165-rb5.dtb qrb5165-rb5-vision-mezzanin
> >   dtb-$(CONFIG_ARCH_QCOM)	+= qrb5165-rb5-vision-mezzanine.dtb
> >   dtb-$(CONFIG_ARCH_QCOM)	+= qru1000-idp.dtb
> >   dtb-$(CONFIG_ARCH_QCOM)	+= sa8155p-adp.dtb
> > +dtb-$(CONFIG_ARCH_QCOM)	+= sa8255p-ride.dtb
> >   dtb-$(CONFIG_ARCH_QCOM)	+= sa8295p-adp.dtb
> >   dtb-$(CONFIG_ARCH_QCOM)	+= sa8540p-ride.dtb
> >   dtb-$(CONFIG_ARCH_QCOM)	+= sa8775p-ride.dtb
> > diff --git a/arch/arm64/boot/dts/qcom/sa8255p-pmics.dtsi b/arch/arm64/boot/dts/qcom/sa8255p-pmics.dtsi
> > new file mode 100644
> > index 000000000000..b00c2b05cef7
> > --- /dev/null
> > +++ b/arch/arm64/boot/dts/qcom/sa8255p-pmics.dtsi
> > @@ -0,0 +1,80 @@
> > +// SPDX-License-Identifier: BSD-3-Clause
> > +/*
> > + * Copyright (c) 2024-2025, Qualcomm Innovation Center, Inc. All rights reserved.
> > + */
> > +
> > +/ {
> > +	thermal-zones {
> > +		pmm8654au_0_thermal: pm8255-0-thermal {
> > +			polling-delay-passive = <100>;
> > +
> > +			trips {
> > +				trip0 {
> > +					temperature = <105000>;
> > +					hysteresis = <0>;
> > +					type = "passive";
> > +				};
> > +
> > +				trip1 {
> > +					temperature = <125000>;
> > +					hysteresis = <0>;
> > +					type = "critical";
> > +				};
> > +			};
> > +		};
> > +
> > +		pmm8654au_1_thermal: pm8255-1-thermal {
> > +			polling-delay-passive = <100>;
> > +
> > +			trips {
> > +				trip0 {
> > +					temperature = <105000>;
> > +					hysteresis = <0>;
> > +					type = "passive";
> > +				};
> > +
> > +				trip1 {
> > +					temperature = <125000>;
> > +					hysteresis = <0>;
> > +					type = "critical";
> > +				};
> > +			};
> > +		};
> > +
> > +		pmm8654au_2_thermal: pm8255-2-thermal {
> > +			polling-delay-passive = <100>;
> > +
> > +			trips {
> > +				trip0 {
> > +					temperature = <105000>;
> > +					hysteresis = <0>;
> > +					type = "passive";
> > +				};
> > +
> > +				trip1 {
> > +					temperature = <125000>;
> > +					hysteresis = <0>;
> > +					type = "critical";
> > +				};
> > +			};
> > +		};
> > +
> > +		pmm8654au_3_thermal: pm8255-3-thermal {
> > +			polling-delay-passive = <100>;
> > +
> > +			trips {
> > +				trip0 {
> > +					temperature = <105000>;
> > +					hysteresis = <0>;
> > +					type = "passive";
> > +				};
> > +
> > +				trip1 {
> > +					temperature = <125000>;
> > +					hysteresis = <0>;
> > +					type = "critical";
> > +				};
> > +			};
> > +		};
> > +	};
> > +};
> 
> PMIC is handled by firmware on this SoC and in my openion we do not need
> to have a dedicated sa8255p-pmics.dtsi only to have thermal zones nodes.
> Can we keep these pmic thermal zones to sa8255p.dtsi with other thermal
> zones nodes ?

For the PMIC? No, they are not a part of the SoC.

-- 
With best wishes
Dmitry

Powered by blists - more mailing lists

Powered by Openwall GNU/*/Linux Powered by OpenVZ