linux-kernel - Re: [PATCH v4 3/4] usb: dwc3: add generic driver to support flattened DT

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Message-ID: <aGc_W5Gfyiw8deYK@cse-cd03-lnx.ap.qualcomm.com>
Date: Fri, 4 Jul 2025 10:41:31 +0800
From: Ze Huang <huangze@...t.edu.cn>
To: Frank Li <Frank.li@....com>, Ze Huang <huangze@...t.edu.cn>
Cc: Thinh Nguyen <Thinh.Nguyen@...opsys.com>,
	Greg Kroah-Hartman <gregkh@...uxfoundation.org>,
	Rob Herring <robh@...nel.org>,
	Krzysztof Kozlowski <krzk+dt@...nel.org>,
	Conor Dooley <conor+dt@...nel.org>, Yixun Lan <dlan@...too.org>,
	Philipp Zabel <p.zabel@...gutronix.de>,
	Paul Walmsley <paul.walmsley@...ive.com>,
	Palmer Dabbelt <palmer@...belt.com>,
	Albert Ou <aou@...s.berkeley.edu>, Alexandre Ghiti <alex@...ti.fr>,
	"linux-usb@...r.kernel.org" <linux-usb@...r.kernel.org>,
	"devicetree@...r.kernel.org" <devicetree@...r.kernel.org>,
	"linux-riscv@...ts.infradead.org" <linux-riscv@...ts.infradead.org>,
	"spacemit@...ts.linux.dev" <spacemit@...ts.linux.dev>,
	"linux-kernel@...r.kernel.org" <linux-kernel@...r.kernel.org>
Subject: Re: [PATCH v4 3/4] usb: dwc3: add generic driver to support
 flattened DT

On Thu, Jul 03, 2025 at 10:10:26PM -0400, Frank Li wrote:
> On Tue, Jun 03, 2025 at 10:51:27AM +0800, Ze Huang wrote:
> > On Tue, Jun 03, 2025 at 01:20:35AM +0000, Thinh Nguyen wrote:
> > > On Mon, May 26, 2025, Ze Huang wrote:
> > > > To support flattened dwc3 dt model and drop the glue layer, introduce the
> > > > `dwc3-generic` driver. This enables direct binding of the DWC3 core driver
> > > > and offers an alternative to the existing glue driver `dwc3-of-simple`.
> > > >
> > > > Signed-off-by: Ze Huang <huangze@...t.edu.cn>
> > > > ---
> 
> Any progress on this patch? If you have not time, I can continue work on
> this one.

Hi Frank,

I was planning to submit everything together for full functionality, but since
Alex's PHY work[1] is almost done, I'll send out the USB generic driver part
separately first.

Link: https://lore.kernel.org/all/5084a99a-9140-4c4f-9873-f5478f48a49d@ieee.org/ [1]

> 
> Frank Li
>

Thanks,
Ze