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Message-Id: <175164870782.4003146.18058724639917920993.b4-ty@kernel.org>
Date: Fri, 4 Jul 2025 18:44:13 +0100
From: Will Deacon <will@...nel.org>
To: robin.murphy@....com,
mark.rutland@....com,
Zhiyuan Dai <daizhiyuan@...tium.com.cn>
Cc: catalin.marinas@....com,
kernel-team@...roid.com,
Will Deacon <will@...nel.org>,
linux-arm-kernel@...ts.infradead.org,
linux-perf-users@...r.kernel.org,
linux-kernel@...r.kernel.org
Subject: Re: [PATCH] perf/arm-cmn: Broaden module description for wider interconnect support
On Thu, 22 May 2025 11:21:22 +0800, Zhiyuan Dai wrote:
> The current MODULE_DESCRIPTION only mentions CMN-600, but this driver
> now supports several Arm mesh interconnects including CMN-650, CMN-700,
> CI-700, and CMN-S3.
>
> Update the MODULE_DESCRIPTION to reflect the expanded scope.
>
>
> [...]
Applied to will (for-next/perf), thanks!
[1/1] perf/arm-cmn: Broaden module description for wider interconnect support
https://git.kernel.org/will/c/8b177e9a4ecd
Cheers,
--
Will
https://fixes.arm64.dev
https://next.arm64.dev
https://will.arm64.dev
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