linux-kernel - Re: [PATCH V2 1/3] dt-bindings: interconnect: Add EPSS L3 compatible for QCS8300 SoC

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Message-ID: <c9887764-8085-4abe-9188-9690ea8b5191@kernel.org>
Date: Sun, 13 Jul 2025 10:34:47 +0200
From: Krzysztof Kozlowski <krzk@...nel.org>
To: Raviteja Laggyshetty <raviteja.laggyshetty@....qualcomm.com>,
 Georgi Djakov <djakov@...nel.org>, Rob Herring <robh@...nel.org>,
 Krzysztof Kozlowski <krzk+dt@...nel.org>, Conor Dooley
 <conor+dt@...nel.org>, Bjorn Andersson <andersson@...nel.org>,
 Konrad Dybcio <konradybcio@...nel.org>, Sibi Sankar
 <quic_sibis@...cinc.com>, Odelu Kukatla <quic_okukatla@...cinc.com>,
 Mike Tipton <mdtipton@...cinc.com>
Cc: linux-arm-msm@...r.kernel.org, linux-pm@...r.kernel.org,
 devicetree@...r.kernel.org, linux-kernel@...r.kernel.org
Subject: Re: [PATCH V2 1/3] dt-bindings: interconnect: Add EPSS L3 compatible
 for QCS8300 SoC

On 11/07/2025 12:25, Raviteja Laggyshetty wrote:
> Add Epoch Subsystem (EPSS) L3 interconnect provider binding for
> QCS8300 SoC. As the EPSS hardware in QCS8300 and SA8775P are same,
> added a family-level compatible for SA877P SoC. This shared fallback
> compatible allows grouping of SoCs with similar hardware, reducing
> the need to explicitly list each variant in the driver match table.
> 
> Signed-off-by: Raviteja Laggyshetty <raviteja.laggyshetty@....qualcomm.com>
> ---

Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@...aro.org>

Best regards,
Krzysztof