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Message-ID: <20250919211703.gbaqcc6mhtgolomt@synopsys.com>
Date: Fri, 19 Sep 2025 21:17:04 +0000
From: Thinh Nguyen <Thinh.Nguyen@...opsys.com>
To: Frank Li <Frank.li@....com>
CC: Thinh Nguyen <Thinh.Nguyen@...opsys.com>,
Greg Kroah-Hartman <gregkh@...uxfoundation.org>,
Rob Herring <robh@...nel.org>,
Krzysztof Kozlowski <krzk+dt@...nel.org>,
Conor Dooley <conor+dt@...nel.org>, Shawn Guo <shawnguo@...nel.org>,
"linux-usb@...r.kernel.org" <linux-usb@...r.kernel.org>,
"devicetree@...r.kernel.org" <devicetree@...r.kernel.org>,
"linux-kernel@...r.kernel.org" <linux-kernel@...r.kernel.org>,
"linux-arm-kernel@...ts.infradead.org" <linux-arm-kernel@...ts.infradead.org>,
"bjorn.andersson@....qualcomm.com" <bjorn.andersson@....qualcomm.com>
Subject: Re: [PATCH 2/3] usb: dwc3: add layerscape dwc3 support
On Tue, Jun 03, 2025, Frank Li wrote:
> On Tue, Jun 03, 2025 at 01:23:03AM +0000, Thinh Nguyen wrote:
> >
> > Is this something that can be enhanced in dwc3-generic-plat glue from Ze
> > Huang:
>
> Yes, I can base on Zehuang's work with little modify. Please let me know
> when his patch merged.
>
Greg picked up Zehuang's changes[*] on his usb-next branch.
https://git.kernel.org/pub/scm/linux/kernel/git/gregkh/usb.git/commit/?h=usb-next&id=e0b6dc00c701e600e655417aab1e100b73de821a
Thanks,
Thinh
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