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Message-ID: <cf043ce8-0e83-41cc-b294-93dc1c27fd91@oss.qualcomm.com>
Date: Thu, 25 Sep 2025 11:26:42 -0700
From: Trilok Soni <trilok.soni@....qualcomm.com>
To: "Aiqun(Maria) Yu" <aiqun.yu@....qualcomm.com>,
        Krzysztof Kozłowski <k.kozlowski.k@...il.com>,
        Jingyi Wang <jingyi.wang@....qualcomm.com>
Cc: Bjorn Andersson <andersson@...nel.org>,
        Konrad Dybcio <konradybcio@...nel.org>, Rob Herring <robh@...nel.org>,
        Krzysztof Kozlowski <krzk+dt@...nel.org>,
        Conor Dooley
 <conor+dt@...nel.org>, linux-arm-msm@...r.kernel.org,
        devicetree@...r.kernel.org, linux-kernel@...r.kernel.org,
        tingwei.zhang@....qualcomm.com, yijie.yang@....qualcomm.com,
        Ronak Raheja <ronak.raheja@....qualcomm.com>
Subject: Re: [PATCH 06/20] arm64: dts: qcom: kaanapali: Add USB support for
 Kaanapali SoC

On 9/25/2025 12:39 AM, Aiqun(Maria) Yu wrote:
> On 9/25/2025 9:50 AM, Krzysztof Kozłowski wrote:
>> On Thu, 25 Sept 2025 at 09:17, Jingyi Wang <jingyi.wang@....qualcomm.com> wrote:
>>>
>>> From: Ronak Raheja <ronak.raheja@....qualcomm.com>
>>>
>>> Add the base USB devicetree definitions for Kaanapali platform. The overall
>>> chipset contains a single DWC3 USB3 controller (rev. 200a), SS QMP PHY
>>> (rev. v8) and M31 eUSB2 PHY.
>>>
>>> Signed-off-by: Ronak Raheja <ronak.raheja@....qualcomm.com>
>>> Signed-off-by: Jingyi Wang <jingyi.wang@....qualcomm.com>
>>> ---
>>>  arch/arm64/boot/dts/qcom/kaanapali.dtsi | 155 ++++++++++++++++++++++++++++++++
>>>  1 file changed, 155 insertions(+)
>>>
>>
>>
>> Second try, without HTML:
>>
>> I really don't understand why you created such huge patchset. Year
>> ago, two years ago, we were discussing it already and explained that's
>> just inflating the patchset without reason.
>>
>> New Soc is one logical change. Maybe two. Not 18!
> 
> It was previously squashed into the base soc dtsi patch and mark like:
> Written with help from Jyothi Kumar Seerapu(added bus), Ronak Raheja
> (added USB), Manish Pandey(added SDHCI), Gaurav Kashyap(added crypto),
> Manaf Meethalavalappu Pallikunhi(added tsens), Qiang Yu(added PCIE) and
> Jinlong Mao(added coresight).
> 
> While it is over 4000+ lines when we squash it together.
> Also as offline reviewed with Bjorn, he suggested us to split out the
> USB and other parts.
> 
>>
>> Not one patch per node or feature.
>>
>> This hides big picture, makes difficult to review everything,
>> difficult to test. Your patch count for LWN stats doesn't matter to
>> us.

Maria - the point here is to not design the series / code for stats, but
per maintainer expectations. Though it is difficult to know one preferred guideline.

> 
> With the current splitting, the different author as each co-developer
> can get the meaningful LWN stats.>
>> NAK and I'm really disappointed I have to repeat the same review .
> Currently, there are 10 SoC DTSI patches sent, structured as follows:
> 
> SoC initial
> Base MTP board
> SoC PCIe0
> SoC SDC2
> SoC USB
> SoC remoteproc
> SoC SPMI bus, TSENS, RNG, QCrypto, and Coresight
> SoC additional features
> SoC audio
> SoC CAMSS
> SoC video
> 
> Which parts would you prefer to squash into pls?
> 


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