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Message-ID: <20250925121155.2401934-1-yangzh0906@thundersoft.com>
Date: Thu, 25 Sep 2025 20:11:54 +0800
From: Albert Yang <yangzh0906@...ndersoft.com>
To: arnd@...db.de
Cc: adrian.hunter@...el.com,
bst-upstream@...ai.top,
catalin.marinas@....com,
conor+dt@...nel.org,
devicetree@...r.kernel.org,
gordon.ge@....ai,
krzk+dt@...nel.org,
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yangzh0906@...ndersoft.com
Subject: Re: [PATCH 0/9] arm64: introduce Black Sesame Technologies C1200 SoC and CDCU1.0 board
On Thu, Sep 25, 2025 at 05:03:57PM +0800, Albert Yang wrote:Subject: Re: [PATCH] splitting SoC and MMC parts
Hi Arnd,
I may have missed an important detail in my previous note. If I split
out the MMC-related patches and submit only the SoC parts first, I
cannot validate the SoC on real hardware: both the kernel and the root
filesystem live on the MMC device. Without the MMC stack (DT bindings
and the controller driver), the board does not boot to userspace, so I
cannot properly verify the SoC/DT changes in isolation.
Would you prefer that I:
- keep the MMC pieces in the same series for initial bring-up; or
- validate everything locally, then send only the SoC/DT parts first and
follow up with the MMC binding/driver as a separate series?
I’m not entirely sure which approach best matches the normal workflow,
so your guidance would be appreciated. I can proceed whichever way you
think is most appropriate.
Thanks for the review and suggestions.
Best regards,
Albert
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