linux-kernel - Re: [PATCH 1/2] dt-bindings: interconnect: document the RPMh Network-On-Chip interconnect in Kaanapali SoC

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Message-ID: <f4e7a388-54fd-42a7-8960-be6a3de7ec6a@oss.qualcomm.com>
Date: Thu, 25 Sep 2025 14:40:53 +0200
From: Konrad Dybcio <konrad.dybcio@....qualcomm.com>
To: Eugen Hristev <eugen.hristev@...aro.org>,
        Jingyi Wang <jingyi.wang@....qualcomm.com>,
        Georgi Djakov
 <djakov@...nel.org>, Rob Herring <robh@...nel.org>,
        Krzysztof Kozlowski <krzk+dt@...nel.org>,
        Conor Dooley
 <conor+dt@...nel.org>,
        Raviteja Laggyshetty <raviteja.laggyshetty@....qualcomm.com>
Cc: linux-arm-msm@...r.kernel.org, linux-pm@...r.kernel.org,
        devicetree@...r.kernel.org, linux-kernel@...r.kernel.org,
        aiqun.yu@....qualcomm.com, tingwei.zhang@....qualcomm.com,
        trilok.soni@....qualcomm.com, yijie.yang@....qualcomm.com
Subject: Re: [PATCH 1/2] dt-bindings: interconnect: document the RPMh
 Network-On-Chip interconnect in Kaanapali SoC

On 9/25/25 10:57 AM, Eugen Hristev wrote:
> 
> 
> On 9/25/25 02:02, Jingyi Wang wrote:
>> From: Raviteja Laggyshetty <raviteja.laggyshetty@....qualcomm.com>
>>
>> Document the RPMh Network-On-Chip Interconnect of the Kaanapali platform.
>>
>> Signed-off-by: Raviteja Laggyshetty <raviteja.laggyshetty@....qualcomm.com>
>> Signed-off-by: Jingyi Wang <jingyi.wang@....qualcomm.com>
>> ---

[...]

>> +properties:
>> +  compatible:
>> +    enum:
>> +      - qcom,kaanapali-aggre-noc
> 
> Hi,
> 
> Does Kaanapali have a single aggre node, or there are several ?
> On previous SoC, I see there are two (aggre1 and aggre2).
> Also in your driver (second patch), I notice aggre1_noc and aggre2_noc .
> It would make sense to accurately describe here the hardware.

They're physically separate

Konrad