linux-kernel - Re: stable: commit "cpuidle: menu: Avoid discarding useful information" causes regressions

lists.openwall.net		lists / announce owl-users owl-dev john-users john-dev passwdqc-users yescrypt popa3d-users / oss-security kernel-hardening musl sabotage tlsify passwords / crypt-dev xvendor / Bugtraq Full-Disclosure linux-kernel linux-netdev linux-ext4 linux-hardening linux-cve-announce PHC
Open Source and information security mailing list archives

Hash Suite: Windows password security audit tool. GUI, reports in PDF.

[<prev] [next>] [<thread-prev] [thread-next>] [day] [month] [year] [list]

Message-ID: <ewahdjfgiog4onnrd2i4vg4ucbrchesrkksrqqpr7apyy6b76p@uznmxhbcwctw>
Date: Thu, 16 Oct 2025 13:59:02 +0900
From: Sergey Senozhatsky <senozhatsky@...omium.org>
To: Doug Smythies <dsmythies@...us.net>
Cc: 'Sergey Senozhatsky' <senozhatsky@...omium.org>, 
	"'Rafael J. Wysocki'" <rafael@...nel.org>, 'Christian Loehle' <christian.loehle@....com>, 
	"'Rafael J. Wysocki'" <rafael.j.wysocki@...el.com>, 'Greg Kroah-Hartman' <gregkh@...uxfoundation.org>, 
	'Artem Bityutskiy' <artem.bityutskiy@...ux.intel.com>, 'Sasha Levin' <sashal@...nel.org>, 
	'Daniel Lezcano' <daniel.lezcano@...aro.org>, linux-pm@...r.kernel.org, linux-kernel@...r.kernel.org, 
	'Tomasz Figa' <tfiga@...omium.org>, stable@...r.kernel.org
Subject: Re: stable: commit "cpuidle: menu: Avoid discarding useful
 information" causes regressions

On (25/10/15 07:11), Doug Smythies wrote:
> >> What thermal limiting methods are being used? Is idle injection being used? Or CPU frequency limiting or both.
> >
> > How do I find out?
> 
> From the turbostat data you do not appear to be using the TCC offset method. This line:
> 
> cpu0: MSR_IA32_TEMPERATURE_TARGET: 0x0f690080 (105 C)
> 
> whereas on my test computer, using the TCC offset method, shows:
> 
>  cpu0: MSR_IA32_TEMPERATURE_TARGET: 0x14641422 (80 C) (100 default - 20 offset)
> 
> To check if thermal is being used do:
> 
> systemctl status thermal

chromeos doesn't use systemd.
A quick ps grep doesn't show any thermal-related processes.