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Message-ID: <zf5ztvnzaf6tplpjpytwbhktrebdnst2doybuubp6rjfj2fjs7@t2ma4ylx67gx>
Date: Mon, 15 Dec 2025 21:51:25 +0200
From: Dmitry Baryshkov <dmitry.baryshkov@....qualcomm.com>
To: Manaf Meethalavalappu Pallikunhi <manaf.pallikunhi@....qualcomm.com>
Cc: Bjorn Andersson <andersson@...nel.org>,
Konrad Dybcio <konradybcio@...nel.org>, Rob Herring <robh@...nel.org>,
Krzysztof Kozlowski <krzk+dt@...nel.org>,
Conor Dooley <conor+dt@...nel.org>,
Gaurav Kohli <gaurav.kohli@....qualcomm.com>,
linux-arm-msm@...r.kernel.org, devicetree@...r.kernel.org,
linux-kernel@...r.kernel.org
Subject: Re: [PATCH] arm64: dts: qcom: qcs6490-rb3gen2: Adjust tsens thermal
zone configuration
On Mon, Dec 15, 2025 at 04:29:34PM +0530, Manaf Meethalavalappu Pallikunhi wrote:
> The QCS6490 rb3gen2 board uses the same Qualcomm QCM6490 platform
Is there a difference between QCS6490 and QCM6490 or between QC[SM]6490
and SC7280?
> but has a different thermal junction temperature specification
> due to package-level differences.
>
> Update passive/hot trip thresholds to 105°C and critical trip
> thresholds to 115°C for various subsystem TSENS sensors.
>
> Disable CPU cooling maps for CPU TSENS since CPU thermal mitigation
> is handled automatically in hardware on this board.
Is it a peculiarity of the RB3 Gen2 or is it that Chrome devices didn't
do it? What about QCM6490 IDP or FairPhone FP5?
>
> Signed-off-by: Manaf Meethalavalappu Pallikunhi <manaf.pallikunhi@....qualcomm.com>
> ---
> arch/arm64/boot/dts/qcom/qcs6490-rb3gen2.dts | 334 +++++++++++++++++++
> 1 file changed, 334 insertions(+)
>
--
With best wishes
Dmitry
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