linux-kernel - Re: [PATCH v1 3/8] dt-bindings: thermal: Add qcom,qmi-cooling yaml bindings

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Message-ID: <f6bd1bda-6aab-4d4e-9981-f55cce03f70d@kernel.org>
Date: Wed, 24 Dec 2025 09:57:26 +0100
From: Krzysztof Kozlowski <krzk@...nel.org>
To: Gaurav Kohli <gaurav.kohli@....qualcomm.com>, andersson@...nel.org,
 mathieu.poirier@...aro.org, robh@...nel.org, krzk+dt@...nel.org,
 conor+dt@...nel.org, rafael@...nel.org, daniel.lezcano@...aro.org,
 rui.zhang@...el.com, lukasz.luba@....com, konradybcio@...nel.org,
 amitk@...nel.org, mani@...nel.org, casey.connolly@...aro.org
Cc: linux-arm-msm@...r.kernel.org, devicetree@...r.kernel.org,
 linux-kernel@...r.kernel.org, linux-pm@...r.kernel.org
Subject: Re: [PATCH v1 3/8] dt-bindings: thermal: Add qcom,qmi-cooling yaml
 bindings

On 23/12/2025 13:32, Gaurav Kohli wrote:
> The cooling subnode of a remoteproc represents a client of the Thermal
> Mitigation Device QMI service running on it. Each subnode of the cooling
> node represents a single control exposed by the service.
> 
> Add maintainer name also and update this binding for cdsp substem.
> 
> Co-developed-by: Casey Connolly <casey.connolly@...aro.org>
> Signed-off-by: Gaurav Kohli <gaurav.kohli@....qualcomm.com>
> Signed-off-by: Casey Connolly <casey.connolly@...aro.org>
> ---
>  .../bindings/remoteproc/qcom,pas-common.yaml  |  6 ++
>  .../bindings/thermal/qcom,qmi-cooling.yaml    | 99 +++++++++++++++++++
>  2 files changed, 105 insertions(+)
>  create mode 100644 Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml
> 
> diff --git a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
> index 63a82e7a8bf8..bbc82253f76b 100644
> --- a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
> +++ b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
> @@ -77,6 +77,12 @@ properties:
>        and devices related to the ADSP.
>      unevaluatedProperties: false
>  
> +  cooling:
> +    $ref: /schemas/thermal/qcom,qmi-cooling.yaml#
> +    description:
> +      Cooling subnode which represents the cooling devices exposed by the Modem.
> +    unevaluatedProperties: false
> +
>  required:
>    - clocks
>    - clock-names
> diff --git a/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml b/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml
> new file mode 100644
> index 000000000000..90b46712d241
> --- /dev/null
> +++ b/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml
> @@ -0,0 +1,99 @@
> +# SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause)
> +# Copyright 2023 (c), Linaro Limited
> +
> +%YAML 1.2
> +---
> +$id: http://devicetree.org/schemas/thermal/qcom,qmi-cooling.yaml#
> +$schema: http://devicetree.org/meta-schemas/core.yaml#
> +
> +title: Qualcomm QMI based thermal mitigation (TMD) cooling devices.
> +
> +maintainers:
> +  - Caleb Connolly <caleb.connolly@...aro.org>
> +  - Gaurav Kohli <gaurav.kohli@....qualcomm.com>
> +
> +description:
> +  Qualcomm QMI-based TMD cooling devices are used to mitigate thermal conditions
> +  across multiple remote subsystems. These devices operate based on junction temperature
> +  sensors (TSENS) associated with thermal zones for each subsystem.
> +
> +  Each subnode corresponds to a control interface for a single instance of the TMD
> +  service running on a remote subsystem.
> +
> +definitions:

defs, look at other code


> +  tmd:
> +    type: object
> +    description: |
> +      A single Thermal Mitigation Device exposed by a remote subsystem.

Missing proper formatting. Please do not send us code written by LLM.

> +    properties:
> +      label:
> +        maxItems: 1
> +      "#cooling-cells":
> +        $ref: /schemas/thermal/thermal-cooling-devices.yaml#/properties/#cooling-cells
> +      phandle: true

NAK, LLM generated junk. It is not acceptable to send such code.


Best regards,
Krzysztof