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Message-ID: <fc67634b-d47e-452b-bbad-35884b75d0b7@oss.qualcomm.com>
Date: Mon, 29 Dec 2025 14:12:58 +0100
From: Konrad Dybcio <konrad.dybcio@....qualcomm.com>
To: Jingyi Wang <jingyi.wang@....qualcomm.com>,
Bjorn Andersson <andersson@...nel.org>,
Konrad Dybcio <konradybcio@...nel.org>, Rob Herring <robh@...nel.org>,
Krzysztof Kozlowski <krzk+dt@...nel.org>,
Conor Dooley <conor+dt@...nel.org>
Cc: aiqun.yu@....qualcomm.com, tingwei.zhang@....qualcomm.com,
trilok.soni@....qualcomm.com, yijie.yang@....qualcomm.com,
linux-arm-msm@...r.kernel.org, devicetree@...r.kernel.org,
linux-kernel@...r.kernel.org,
Manaf Meethalavalappu Pallikunhi <manaf.pallikunhi@....qualcomm.com>,
Jyothi Kumar Seerapu <jyothi.seerapu@....qualcomm.com>
Subject: Re: [PATCH v2 2/2] arm64: dts: qcom: kaanapali: Add TSENS and QUPv3
serial engines
On 12/26/25 4:06 AM, Jingyi Wang wrote:
> Add new features on the Kaanapali Platform including:
>
> - Temperature Sensor (TSENS) and thermal zones
> - QUPv3 serial engine protocols with 5 I2C hubs and 24 QUP serial engines
> across 4 QUP wrappers, each with support of GPI DMA engines.
>
> Co-developed-by: Manaf Meethalavalappu Pallikunhi <manaf.pallikunhi@....qualcomm.com>
> Signed-off-by: Manaf Meethalavalappu Pallikunhi <manaf.pallikunhi@....qualcomm.com>
> Co-developed-by: Jyothi Kumar Seerapu <jyothi.seerapu@....qualcomm.com>
> Signed-off-by: Jyothi Kumar Seerapu <jyothi.seerapu@....qualcomm.com>
> Signed-off-by: Jingyi Wang <jingyi.wang@....qualcomm.com>
> ---
Since the base DT is now merged, all subsequent patches are
supposed to be patch-sized, i.e. usually scoped for one feature that
makes sense. This one happens to be an arbitrary concatenation of two
separate ones. Were they separate, the original authors would benefit
from the full attribution and they would be easier for us to review
Konrad
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