linux-kernel - Re: [PATCH v1 4/8] thermal: qcom: add qmi-cooling driver

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Message-ID: <68d70a3d-4443-4596-842a-e8a700b276eb@oss.qualcomm.com>
Date: Wed, 31 Dec 2025 08:33:03 +0200
From: Dmitry Baryshkov <dmitry.baryshkov@....qualcomm.com>
To: Gaurav Kohli <gaurav.kohli@....qualcomm.com>
Cc: andersson@...nel.org, mathieu.poirier@...aro.org, robh@...nel.org,
        krzk+dt@...nel.org, conor+dt@...nel.org, rafael@...nel.org,
        daniel.lezcano@...aro.org, rui.zhang@...el.com, lukasz.luba@....com,
        konradybcio@...nel.org, amitk@...nel.org, mani@...nel.org,
        casey.connolly@...aro.org, linux-arm-msm@...r.kernel.org,
        devicetree@...r.kernel.org, linux-kernel@...r.kernel.org,
        linux-pm@...r.kernel.org
Subject: Re: [PATCH v1 4/8] thermal: qcom: add qmi-cooling driver

On 31/12/2025 08:28, Gaurav Kohli wrote:
> 
> On 12/24/2025 1:19 AM, Dmitry Baryshkov wrote:
>> On Tue, Dec 23, 2025 at 06:02:23PM +0530, Gaurav Kohli wrote:
>>> From: Casey Connolly <casey.connolly@...aro.org>
>>>
>>> The Thermal Mitigation Device (TMD) service exposes various platform
>>> specific thermal mitigations available on remote subsystems (ie the
>>> modem and cdsp). The service is exposed via the QMI messaging
>>> interface, usually over the QRTR transport.
>>>
>>> Qualcomm QMI-based TMD cooling devices are used to mitigate thermal
>>> conditions across multiple remote subsystems. These devices operate
>>> based on junction temperature sensors (TSENS) associated with thermal
>>> zones for each subsystem.
>>>
>>> Co-developed-by: Gaurav Kohli <gaurav.kohli@....qualcomm.com>
>>> Signed-off-by: Casey Connolly <casey.connolly@...aro.org>
>>> Signed-off-by: Gaurav Kohli <gaurav.kohli@....qualcomm.com>
>>> ---
>>>   drivers/soc/qcom/Kconfig           |  13 +
>>>   drivers/soc/qcom/Makefile          |   1 +
>>>   drivers/soc/qcom/qmi-cooling.c     | 498 +++++++++++++++++++++++++++++
>>>   drivers/soc/qcom/qmi-cooling.h     | 428 +++++++++++++++++++++++++
>>>   drivers/thermal/qcom/qmi-cooling.h | 428 +++++++++++++++++++++++++
>>>   5 files changed, 1368 insertions(+)
>>>   create mode 100644 drivers/soc/qcom/qmi-cooling.c
>>>   create mode 100644 drivers/soc/qcom/qmi-cooling.h
>>>   create mode 100644 drivers/thermal/qcom/qmi-cooling.h
>>>
>>> diff --git a/drivers/soc/qcom/Kconfig b/drivers/soc/qcom/Kconfig
>>> index 2caadbbcf830..905a24b42fe6 100644
>>> --- a/drivers/soc/qcom/Kconfig
>>> +++ b/drivers/soc/qcom/Kconfig
>>> @@ -124,6 +124,19 @@ config QCOM_PMIC_GLINK
>>>         Say yes here to support USB-C and battery status on modern 
>>> Qualcomm
>>>         platforms.
>>> +config QCOM_QMI_COOLING
>>> +    tristate "Qualcomm QMI cooling drivers"
>>> +    depends on QCOM_RPROC_COMMON
>>> +    depends on ARCH_QCOM || COMPILE_TEST
>>> +    select QCOM_QMI_HELPERS
>>> +    help
>>> +       This enables the remote subsystem cooling devices. These cooling
>>> +       devices will be used by Qualcomm chipset to place various remote
>>> +       subsystem mitigations like remote processor passive mitigation,
>>> +       remote subsystem voltage restriction at low temperatures etc.
>>> +       The QMI cooling device will interface with remote subsystem
>>> +       using Qualcomm remoteproc interface.
>>> +
>>>   config QCOM_QMI_HELPERS
>>>       tristate
>>>       depends on NET
>>> diff --git a/drivers/soc/qcom/Makefile b/drivers/soc/qcom/Makefile
>>> index b7f1d2a57367..b6728f54944b 100644
>>> --- a/drivers/soc/qcom/Makefile
>>> +++ b/drivers/soc/qcom/Makefile
>>> @@ -14,6 +14,7 @@ obj-$(CONFIG_QCOM_PMIC_GLINK)    += pmic_glink.o
>>>   obj-$(CONFIG_QCOM_PMIC_GLINK)    += pmic_glink_altmode.o
>>>   obj-$(CONFIG_QCOM_PMIC_PDCHARGER_ULOG)    += pmic_pdcharger_ulog.o
>>>   CFLAGS_pmic_pdcharger_ulog.o    :=  -I$(src)
>>> +obj-$(CONFIG_QCOM_QMI_COOLING) += qmi-cooling.o
>>>   obj-$(CONFIG_QCOM_QMI_HELPERS)    += qmi_helpers.o
>>>   qmi_helpers-y    += qmi_encdec.o qmi_interface.o
>>>   obj-$(CONFIG_QCOM_RAMP_CTRL)    += ramp_controller.o
>>> diff --git a/drivers/soc/qcom/qmi-cooling.c b/drivers/soc/qcom/qmi- 
>>> cooling.c
>>> new file mode 100644
>>> index 000000000000..1a6afcb96bf6
>>> --- /dev/null
>>> +++ b/drivers/soc/qcom/qmi-cooling.c
>>> @@ -0,0 +1,498 @@
>>> +// SPDX-License-Identifier: GPL-2.0
>>> +/*
>>> + * Copyright (c) 2017, The Linux Foundation
>>> + * Copyright (c) 2025, Linaro Limited
>>> + *
>>> + * QMI Thermal Mitigation Device (TMD) client driver.
>>> + * This driver provides an in-kernel client to handle hot and cold 
>>> thermal
>>> + * mitigations for remote subsystems (modem and DSPs) running the 
>>> TMD service.
>>> + * It doesn't implement any handling of reports from remote subsystems.
>>> + */
>>> +
>>> +#include <linux/cleanup.h>
>>> +#include <linux/err.h>
>>> +#include <linux/module.h>
>>> +#include <linux/net.h>
>>> +#include <linux/of.h>
>>> +#include <linux/platform_device.h>
>>> +#include <linux/remoteproc/qcom_rproc.h>
>>> +#include <linux/remoteproc_cooling.h>
>>> +#include <linux/slab.h>
>>> +#include <linux/soc/qcom/qmi.h>
>>> +#include <linux/thermal.h>
>>> +
>>> +#include "qmi-cooling.h"
>>> +
>>> +#define MODEM0_INSTANCE_ID    0x0
>>> +#define ADSP_INSTANCE_ID    0x1
>>> +#define CDSP_INSTANCE_ID    0x43
>> Will CDSP1 also use instance ID? What are instance IDs for GPDSP?
> 
> 
> In Leman's there are two different cdsp subsytem, i will add new 
> instance id for that also.
> 
> What is GPdsp, you mean gpu ?
> 

No, I mean general purpose DSP aka GPDSP aka GDSP.

-- 
With best wishes
Dmitry