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Message-ID: <qbbn4dpp52nojvi3fge5kotnxcetuhsqhtvm6rl7rjbo46e2ly@cp24xlhdk54h>
Date: Wed, 31 Dec 2025 09:47:24 +0200
From: Dmitry Baryshkov <dmitry.baryshkov@....qualcomm.com>
To: Gaurav Kohli <gaurav.kohli@....qualcomm.com>
Cc: Krzysztof Kozlowski <krzk@...nel.org>, andersson@...nel.org,
mathieu.poirier@...aro.org, robh@...nel.org, krzk+dt@...nel.org,
conor+dt@...nel.org, rafael@...nel.org, daniel.lezcano@...aro.org,
rui.zhang@...el.com, lukasz.luba@....com, konradybcio@...nel.org,
amitk@...nel.org, mani@...nel.org, casey.connolly@...aro.org,
linux-arm-msm@...r.kernel.org, devicetree@...r.kernel.org,
linux-kernel@...r.kernel.org, linux-pm@...r.kernel.org
Subject: Re: [PATCH v1 3/8] dt-bindings: thermal: Add qcom,qmi-cooling yaml
bindings
On Wed, Dec 31, 2025 at 12:12:04PM +0530, Gaurav Kohli wrote:
>
> On 12/24/2025 3:54 PM, Krzysztof Kozlowski wrote:
> > On 24/12/2025 11:08, Gaurav Kohli wrote:
> > > On 12/24/2025 2:27 PM, Krzysztof Kozlowski wrote:
> > > > On 23/12/2025 13:32, Gaurav Kohli wrote:
> > > > > The cooling subnode of a remoteproc represents a client of the Thermal
> > > > > Mitigation Device QMI service running on it. Each subnode of the cooling
> > > > > node represents a single control exposed by the service.
> > > > >
> > > > > Add maintainer name also and update this binding for cdsp substem.
> > > > >
> > > > > Co-developed-by: Casey Connolly <casey.connolly@...aro.org>
> > > > > Signed-off-by: Gaurav Kohli <gaurav.kohli@....qualcomm.com>
> > > > > Signed-off-by: Casey Connolly <casey.connolly@...aro.org>
> > > > > ---
> > > > > .../bindings/remoteproc/qcom,pas-common.yaml | 6 ++
> > > > > .../bindings/thermal/qcom,qmi-cooling.yaml | 99 +++++++++++++++++++
> > > > > 2 files changed, 105 insertions(+)
> > > > > create mode 100644 Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml
> > > > >
> > > > > diff --git a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
> > > > > index 63a82e7a8bf8..bbc82253f76b 100644
> > > > > --- a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
> > > > > +++ b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
> > > > > @@ -77,6 +77,12 @@ properties:
> > > > > and devices related to the ADSP.
> > > > > unevaluatedProperties: false
> > > > > + cooling:
> > > > > + $ref: /schemas/thermal/qcom,qmi-cooling.yaml#
> > > > > + description:
> > > > > + Cooling subnode which represents the cooling devices exposed by the Modem.
> > > > > + unevaluatedProperties: false
> > > > > +
> > > > > required:
> > > > > - clocks
> > > > > - clock-names
> > > > > diff --git a/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml b/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml
> > > > > new file mode 100644
> > > > > index 000000000000..90b46712d241
> > > > > --- /dev/null
> > > > > +++ b/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml
> > > > > @@ -0,0 +1,99 @@
> > > > > +# SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause)
> > > > > +# Copyright 2023 (c), Linaro Limited
> > > > > +
> > > > > +%YAML 1.2
> > > > > +---
> > > > > +$id: http://devicetree.org/schemas/thermal/qcom,qmi-cooling.yaml#
> > > > > +$schema: http://devicetree.org/meta-schemas/core.yaml#
> > > > > +
> > > > > +title: Qualcomm QMI based thermal mitigation (TMD) cooling devices.
> > > > > +
> > > > > +maintainers:
> > > > > + - Caleb Connolly <caleb.connolly@...aro.org>
> > > > > + - Gaurav Kohli <gaurav.kohli@....qualcomm.com>
> > > > > +
> > > > > +description:
> > > > > + Qualcomm QMI-based TMD cooling devices are used to mitigate thermal conditions
> > > > > + across multiple remote subsystems. These devices operate based on junction temperature
> > > > > + sensors (TSENS) associated with thermal zones for each subsystem.
> > > > > +
> > > > > + Each subnode corresponds to a control interface for a single instance of the TMD
> > > > > + service running on a remote subsystem.
> > > > > +
> > > > > +definitions:
> > > > defs, look at other code
> > > >
> > > >
> > > > > + tmd:
> > > > > + type: object
> > > > > + description: |
> > > > > + A single Thermal Mitigation Device exposed by a remote subsystem.
> > > > Missing proper formatting. Please do not send us code written by LLM.
> > >
> > > This patch is based on older series
> > >
> > > https://lore.kernel.org/linux-devicetree/20230905-caleb-qmi_cooling-v1-0-5aa39d4164a7@linaro.org/, did some manual changes to remove unusable code.
> > How? This is v1, not v2. How did you address other comments? Where did
> > you provide proper changelog? Why this is not correctly versioned/
> >
> > > let me fix the formatting. This is not generated code.
> > I do not believe, because this:
> >
> >
> > > > > + phandle: true
>
>
> As i have mentioned in earlier reply, we are including below series:
>
> https://lore.kernel.org/linux-devicetree/20230905-caleb-qmi_cooling-v1-0-5aa39d4164a7@linaro.org/,)
> as this is client for remote proc cooling.
> I was seeing this error while using older yam files.
>
> ('cdsp_sw' was unexpected)
>
> from schema qcom,qmi-cooling.yaml
>
> So to avoid that, i have added phandle to avoid this error. will fix this in
> proper way
> by including another yaml file which will define the cdsp_sw,
>
> Below is the dt node:
> cooling {
> + compatible = "qcom,qmi-cooling-cdsp";
> + cdsp_sw: cdsp_sw {
You can't have a node called cdsp_sw. Underscores are not allowed in
node names.
> + label = "cdsp_sw";
> + #cooling-cells = <2>;
> + };
> + };
>
>
> > Does not exist. You cannot come with something like that, there is no
> > such code.
> >
> > Only LLM when parsing DTB could invent something like this. Otherwise
> > explain me please the process leading to coming to such change.
> >
> > Best regards,
> > Krzysztof
--
With best wishes
Dmitry
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