| lists.openwall.net | lists / announce owl-users owl-dev john-users john-dev passwdqc-users yescrypt popa3d-users / oss-security kernel-hardening musl sabotage tlsify passwords / crypt-dev xvendor / Bugtraq Full-Disclosure linux-kernel linux-netdev linux-ext4 linux-hardening linux-cve-announce PHC | |
|
Open Source and information security mailing list archives
| ||
|
Message-ID:
<TY6PR01MB17377CE455D4E2142554EA134FF84A@TY6PR01MB17377.jpnprd01.prod.outlook.com>
Date: Wed, 7 Jan 2026 17:06:20 +0000
From: John Madieu <john.madieu.xa@...renesas.com>
To: Cosmin-Gabriel Tanislav <cosmin-gabriel.tanislav.xa@...esas.com>, "Rafael
J . Wysocki" <rafael@...nel.org>, Daniel Lezcano <daniel.lezcano@...aro.org>,
Zhang Rui <rui.zhang@...el.com>, Lukasz Luba <lukasz.luba@....com>, Rob
Herring <robh@...nel.org>, Krzysztof Kozlowski <krzk+dt@...nel.org>, Conor
Dooley <conor+dt@...nel.org>, Geert Uytterhoeven <geert+renesas@...der.be>,
magnus.damm <magnus.damm@...il.com>, Philipp Zabel <p.zabel@...gutronix.de>
CC: "linux-pm@...r.kernel.org" <linux-pm@...r.kernel.org>,
"devicetree@...r.kernel.org" <devicetree@...r.kernel.org>,
"linux-kernel@...r.kernel.org" <linux-kernel@...r.kernel.org>,
"linux-renesas-soc@...r.kernel.org" <linux-renesas-soc@...r.kernel.org>,
Cosmin-Gabriel Tanislav <cosmin-gabriel.tanislav.xa@...esas.com>
Subject: RE: [PATCH v3 2/9] thermal: renesas: rzg3e: make min and max
temperature per-chip
Hi Cosmin,
Thanks for the patch.
> -----Original Message-----
> From: Cosmin Tanislav <cosmin-gabriel.tanislav.xa@...esas.com>
> Sent: Wednesday, November 26, 2025 2:04 PM
> To: John Madieu <john.madieu.xa@...renesas.com>; Rafael J . Wysocki
> <rafael@...nel.org>; Daniel Lezcano <daniel.lezcano@...aro.org>; Zhang Rui
> <rui.zhang@...el.com>; Lukasz Luba <lukasz.luba@....com>; Rob Herring
> <robh@...nel.org>; Krzysztof Kozlowski <krzk+dt@...nel.org>; Conor Dooley
> <conor+dt@...nel.org>; Geert Uytterhoeven <geert+renesas@...der.be>;
> magnus.damm <magnus.damm@...il.com>; Philipp Zabel
> <p.zabel@...gutronix.de>
> Cc: linux-pm@...r.kernel.org; devicetree@...r.kernel.org; linux-
> kernel@...r.kernel.org; linux-renesas-soc@...r.kernel.org; Cosmin-Gabriel
> Tanislav <cosmin-gabriel.tanislav.xa@...esas.com>
> Subject: [PATCH v3 2/9] thermal: renesas: rzg3e: make min and max
> temperature per-chip
>
> The Renesas RZ/T2H (R9A09G077) and RZ/N2H (R9A09G087) SoCs have different
> minimum and maximum temperatures compared to the already supported RZ/G3E.
>
> Prepare for them by moving these into a chip-specific struct.
>
> Signed-off-by: Cosmin Tanislav <cosmin-gabriel.tanislav.xa@...esas.com>
> ---
> V3:
> * no changes
>
> V2:
> * no changes
>
> drivers/thermal/renesas/rzg3e_thermal.c | 35 ++++++++++++++++---------
> 1 file changed, 23 insertions(+), 12 deletions(-)
>
> diff --git a/drivers/thermal/renesas/rzg3e_thermal.c
> b/drivers/thermal/renesas/rzg3e_thermal.c
> index 86c10810e5bf..3c9ff5e43d7e 100644
> --- a/drivers/thermal/renesas/rzg3e_thermal.c
> +++ b/drivers/thermal/renesas/rzg3e_thermal.c
> @@ -62,8 +62,6 @@
> #define TSU_SICR_CMPCLR BIT(1)
>
> /* Temperature calculation constants from datasheet */
> -#define TSU_TEMP_D (-41)
> -#define TSU_TEMP_E 126
> #define TSU_CODE_MAX 0xFFF
>
> /* Timing specifications from datasheet */ @@ -72,6 +70,11 @@
> #define TSU_POLL_DELAY_US 10 /* Polling interval */
> #define TSU_MIN_CLOCK_RATE 24000000 /* TSU_PCLK minimum 24MHz */
>
> +struct rzg3e_thermal_info {
> + int temp_d_mc;
> + int temp_e_mc;
> +};
> +
> /**
> * struct rzg3e_thermal_priv - RZ/G3E TSU private data
> * @base: TSU register base
> @@ -79,6 +82,7 @@
> * @syscon: regmap for calibration values
> * @zone: thermal zone device
> * @rstc: reset control
> + * @info: chip type specific information
> * @trmval0: calibration value 0 (b)
> * @trmval1: calibration value 1 (c)
> * @trim_offset: offset for trim registers in syscon @@ -90,6 +94,7 @@
> struct rzg3e_thermal_priv {
> struct regmap *syscon;
> struct thermal_zone_device *zone;
> struct reset_control *rstc;
> + const struct rzg3e_thermal_info *info;
> u16 trmval0;
> u16 trmval1;
> u32 trim_offset;
> @@ -161,17 +166,17 @@ static void rzg3e_thermal_power_off(struct
> rzg3e_thermal_priv *priv)
> */
> static int rzg3e_thermal_code_to_temp(struct rzg3e_thermal_priv *priv,
> u16 code) {
> - int temp_e_mc = TSU_TEMP_E * MILLIDEGREE_PER_DEGREE;
> - int temp_d_mc = TSU_TEMP_D * MILLIDEGREE_PER_DEGREE;
> + const struct rzg3e_thermal_info *info = priv->info;
> s64 numerator, denominator;
> int temp_mc;
>
> - numerator = (temp_e_mc - temp_d_mc) * (s64)(code - priv->trmval0);
> + numerator = (info->temp_e_mc - info->temp_d_mc) *
> + (s64)(code - priv->trmval0);
> denominator = priv->trmval1 - priv->trmval0;
>
> - temp_mc = div64_s64(numerator, denominator) + temp_d_mc;
> + temp_mc = div64_s64(numerator, denominator) + info->temp_d_mc;
>
> - return clamp(temp_mc, temp_d_mc, temp_e_mc);
> + return clamp(temp_mc, info->temp_d_mc, info->temp_e_mc);
> }
>
> /*
> @@ -180,13 +185,12 @@ static int rzg3e_thermal_code_to_temp(struct
> rzg3e_thermal_priv *priv, u16 code)
> */
> static u16 rzg3e_thermal_temp_to_code(struct rzg3e_thermal_priv *priv,
> int temp_mc) {
> - int temp_e_mc = TSU_TEMP_E * MILLIDEGREE_PER_DEGREE;
> - int temp_d_mc = TSU_TEMP_D * MILLIDEGREE_PER_DEGREE;
> + const struct rzg3e_thermal_info *info = priv->info;
> s64 numerator, denominator;
> s64 code;
>
> - numerator = (temp_mc - temp_d_mc) * (priv->trmval1 - priv->trmval0);
> - denominator = temp_e_mc - temp_d_mc;
> + numerator = (temp_mc - info->temp_d_mc) * (priv->trmval1 - priv-
> >trmval0);
> + denominator = info->temp_e_mc - info->temp_d_mc;
>
> code = div64_s64(numerator, denominator) + priv->trmval0;
>
> @@ -392,6 +396,8 @@ static int rzg3e_thermal_probe(struct platform_device
> *pdev)
> return ret;
> platform_set_drvdata(pdev, priv);
>
> + priv->info = device_get_match_data(dev);
> +
> priv->base = devm_platform_ioremap_resource(pdev, 0);
> if (IS_ERR(priv->base))
> return PTR_ERR(priv->base);
> @@ -526,8 +532,13 @@ static const struct dev_pm_ops rzg3e_thermal_pm_ops =
> {
> SYSTEM_SLEEP_PM_OPS(rzg3e_thermal_suspend, rzg3e_thermal_resume) };
>
> +static const struct rzg3e_thermal_info rzg3e_thermal_info = {
> + .temp_d_mc = -41000,
> + .temp_e_mc = 126000,
> +};
> +
> static const struct of_device_id rzg3e_thermal_dt_ids[] = {
> - { .compatible = "renesas,r9a09g047-tsu" },
> + { .compatible = "renesas,r9a09g047-tsu", .data = &rzg3e_thermal_info
> +},
> { /* sentinel */ }
> };
> MODULE_DEVICE_TABLE(of, rzg3e_thermal_dt_ids);
> --
> 2.52.0
Reviewed-by: John Madieu <john.madieu.xa@...renesas.com>
Tested-by: John Madieu <john.madieu.xa@...renesas.com>
Powered by blists - more mailing lists