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Message-ID: <2a39719e-e73b-4558-95fa-d54f94c43220@linaro.org>
Date: Sat, 10 Jan 2026 17:13:55 +0100
From: Casey Connolly <casey.connolly@...aro.org>
To: Gaurav Kohli <gaurav.kohli@....qualcomm.com>, andersson@...nel.org,
mathieu.poirier@...aro.org, robh@...nel.org, krzk+dt@...nel.org,
conor+dt@...nel.org, rafael@...nel.org, daniel.lezcano@...aro.org,
rui.zhang@...el.com, lukasz.luba@....com, konradybcio@...nel.org,
amitk@...nel.org, mani@...nel.org
Cc: linux-arm-msm@...r.kernel.org, devicetree@...r.kernel.org,
linux-kernel@...r.kernel.org, linux-pm@...r.kernel.org
Subject: Re: [PATCH v1 0/8] Add RemoteProc cooling support
On 12/23/25 13:32, Gaurav Kohli wrote:
> This series introduces a generic remote proc cooling framework to control
> thermal sensors located on remote subsystem like modem, dsp etc.
> Communications with these subsystems occurs through various channels, for example,
> QMI interface for Qualcomm.
>
> The Framework provides an abstraction layer between thermal subsytem and vendor
> specific remote subsystem. Vendor drivers are expected to implement callback
> and registration mechanisms with cooling framework to control cooling
> devices.
>
> This patchset also revives earlier discussions of QMI based TMD cooling
> devices discussion posted on below series by Casey:
> https://lore.kernel.org/linux-devicetree/20230905-caleb-qmi_cooling-v1-0-5aa39d4164a7@linaro.org/
>
> That series introduced Qualcomm QMI-based TMD cooling devices which used
> to mitigate thermal conditions across multiple remote subsystems. These
> devices operate based on junction temperature sensors (TSENS) associated
> with thermal zones for each subsystem and registering with remoteproc
> cooling framework for cooling registration.
>
> This patch series has a compilation/runtime dependency on another series [1].
>
> [1] https://lore.kernel.org/linux-devicetree/20250822042316.1762153-1-quic_gkohli@quicinc.com/
>
> Casey Connolly (2):
> remoteproc: qcom: probe all child devices
> thermal: qcom: add qmi-cooling driver
I'm glad this series is getting revived. It would be good if you could
explain what changes you made to my patches somewhere.
I also remember one of my patches adding the DT parts for SDM845, would
you be willing to pick that up for the next revision? I'd be happy to
provide my Tested-by.
Kind regards,
>
> Gaurav Kohli (6):
> thermal: Add Remote Proc cooling driver
> dt-bindings: thermal: Add qcom,qmi-cooling yaml bindings
> arm64: dts: qcom: Enable cdsp qmi tmd devices for lemans
> arm64: dts: qcom: Enable cdsp qmi tmd devices for talos
> arm64: dts: qcom: Enable cdsp qmi tmd devices for kodiak
> arm64: dts: qcom: Enable cdsp qmi tmd devices for monaco
>
> .../bindings/remoteproc/qcom,pas-common.yaml | 6 +
> .../bindings/thermal/qcom,qmi-cooling.yaml | 99 ++++
> MAINTAINERS | 8 +
> arch/arm64/boot/dts/qcom/kodiak.dtsi | 36 ++
> arch/arm64/boot/dts/qcom/lemans.dtsi | 138 ++++-
> arch/arm64/boot/dts/qcom/monaco.dtsi | 92 ++++
> arch/arm64/boot/dts/qcom/talos.dtsi | 23 +
> drivers/remoteproc/qcom_q6v5.c | 4 +
> drivers/remoteproc/qcom_q6v5_mss.c | 8 -
> drivers/soc/qcom/Kconfig | 13 +
> drivers/soc/qcom/Makefile | 1 +
> drivers/soc/qcom/qmi-cooling.c | 498 ++++++++++++++++++
> drivers/soc/qcom/qmi-cooling.h | 428 +++++++++++++++
> drivers/thermal/Kconfig | 11 +
> drivers/thermal/Makefile | 2 +
> drivers/thermal/qcom/qmi-cooling.h | 428 +++++++++++++++
> drivers/thermal/remoteproc_cooling.c | 154 ++++++
> include/linux/remoteproc_cooling.h | 52 ++
> 18 files changed, 1981 insertions(+), 20 deletions(-)
> create mode 100644 Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml
> create mode 100644 drivers/soc/qcom/qmi-cooling.c
> create mode 100644 drivers/soc/qcom/qmi-cooling.h
> create mode 100644 drivers/thermal/qcom/qmi-cooling.h
> create mode 100644 drivers/thermal/remoteproc_cooling.c
> create mode 100644 include/linux/remoteproc_cooling.h
>
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