linux-kernel - [PATCH v2 0/7] thermal: samsung: Add support for Google GS101 TMU

lists.openwall.net		lists / announce owl-users owl-dev john-users john-dev passwdqc-users yescrypt popa3d-users / oss-security kernel-hardening musl sabotage tlsify passwords / crypt-dev xvendor / Bugtraq Full-Disclosure linux-kernel linux-netdev linux-ext4 linux-hardening linux-cve-announce PHC
Open Source and information security mailing list archives
Hash Suite: Windows password security audit tool. GUI, reports in PDF.
[<prev] [next>] [thread-next>] [day] [month] [year] [list]
Message-Id: <20260119-acpm-tmu-v2-0-e02a834f04c6@linaro.org>
Date: Mon, 19 Jan 2026 12:08:46 +0000
From: Tudor Ambarus <tudor.ambarus@...aro.org>
To: "Rafael J. Wysocki" <rafael@...nel.org>, 
 Daniel Lezcano <daniel.lezcano@...aro.org>, Zhang Rui <rui.zhang@...el.com>, 
 Lukasz Luba <lukasz.luba@....com>, Rob Herring <robh@...nel.org>, 
 Krzysztof Kozlowski <krzk+dt@...nel.org>, 
 Conor Dooley <conor+dt@...nel.org>, Krzysztof Kozlowski <krzk@...nel.org>, 
 Alim Akhtar <alim.akhtar@...sung.com>, 
 Bartlomiej Zolnierkiewicz <bzolnier@...il.com>, Kees Cook <kees@...nel.org>, 
 "Gustavo A. R. Silva" <gustavoars@...nel.org>, 
 Peter Griffin <peter.griffin@...aro.org>, 
 André Draszik <andre.draszik@...aro.org>
Cc: willmcvicker@...gle.com, jyescas@...gle.com, shin.son@...sung.com, 
 linux-samsung-soc@...r.kernel.org, linux-kernel@...r.kernel.org, 
 linux-pm@...r.kernel.org, devicetree@...r.kernel.org, 
 linux-arm-kernel@...ts.infradead.org, linux-hardening@...r.kernel.org, 
 Tudor Ambarus <tudor.ambarus@...aro.org>
Subject: [PATCH v2 0/7] thermal: samsung: Add support for Google GS101 TMU

Add support for the Thermal Management Unit (TMU) on the Google GS101
SoC.

The GS101 TMU implementation utilizes a hybrid architecture where
management is shared between the kernel and the Alive Clock and
Power Manager (ACPM) firmware.

Dependencies
============

- firmware patches 2, 3: required by the thermal driver (patch 4).
- bindings (patch 1): required for DTS validation.
- thermal driver patch 4: required by defconfig (patch 7) - logical
dependency. 

Given the thermal driver is a new addition, I suggest everything to go
through the Samsung SoC tree, with ACKs from the Thermal maintainers.

If the Thermal maintainers prefer to take the bindings and the thermal
driver patches via their tree we'll need:
- an immutable branch containing the firmware patches (2 and 3) from the
  Samsung SoC tree to serve as a base for the thermal driver.
- an immutable branch containing the bindings and the thermal driver
  from the thermal tree to serve as a base for the dts and defconfig.

Architecture Overview
=====================

The hardware supports two parallel control paths. For this
implementation, responsibilities are split as follows:

1. Kernel Responsibility:
- maintain direct memory-mapped access to the interrupt pending
  (INTPEND) registers to identify thermal events.
- map physical hardware interrupts to logical thermal zones.
- coordinate functional operations through the ACPM IPC protocol.

2. Firmware Responsibility (ACPM):
- handle sensor initialization and calibration.
- manage thermal thresholds and hysteresis configuration.
- perform temperature acquisition and expose data via IPC.

Sensor Mapping (One-to-Many)
============================

The SoC contains multiple physical temperature sensors, but the ACPM
firmware abstracts these into logical groups (Clusters) for reporting:

- ACPM Sensor 0 (Big Cluster): Aggregates physical sensors 0, 6, 7, 8, 9.
- ACPM Sensor 1 (Mid Cluster): Aggregates physical sensors 4, 5.
- ACPM Sensor 2 (Little Cluster): Aggregates physical sensors 1, 2.

The driver maps physical interrupt bits back to these logical parents.
When an interrupt fires, the driver checks the bitmask in the INTPEND
registers and updates the corresponding logical thermal zone.

Signed-off-by: Tudor Ambarus <tudor.ambarus@...aro.org>
---
Changes in v2:
- architecture: switch from a syscon/MFD approach to a thermal-sensor
  node with a phandle to the ACPM interface
- bindings: address Krzysztof's feedback, drop redundencies,
  interrupts description.
- firmware: introduce devm_acpm_get_by_phandle() to standardize IPC
  handle acquisition.
- thermal driver: drop compatible's data and use the static data from
  the driver directly.
- defconfig, make EXYNOS_ACPM_THERMAL a module
- Link to v1: https://lore.kernel.org/r/20260114-acpm-tmu-v1-0-cfe56d93e90f@linaro.org

---
Tudor Ambarus (7):
      dt-bindings: thermal: Add Google GS101 TMU
      firmware: samsung: acpm: Add TMU protocol support
      firmware: samsung: acpm: Add devm_acpm_get_by_phandle helper
      thermal: samsung: Add support for GS101 TMU
      MAINTAINERS: Add entry for Samsung Exynos ACPM thermal driver
      arm64: dts: exynos: gs101: Add thermal management unit
      arm64: defconfig: enable Exynos ACPM thermal support

 .../bindings/thermal/google,gs101-tmu-top.yaml     |  67 +++
 MAINTAINERS                                        |   8 +
 arch/arm64/boot/dts/exynos/google/gs101-tmu.dtsi   | 209 +++++++
 arch/arm64/boot/dts/exynos/google/gs101.dtsi       |  18 +
 arch/arm64/configs/defconfig                       |   1 +
 drivers/firmware/samsung/Makefile                  |   1 +
 drivers/firmware/samsung/exynos-acpm-tmu.c         | 212 +++++++
 drivers/firmware/samsung/exynos-acpm-tmu.h         |  33 ++
 drivers/firmware/samsung/exynos-acpm.c             |  35 ++
 drivers/thermal/samsung/Kconfig                    |  16 +
 drivers/thermal/samsung/Makefile                   |   2 +
 drivers/thermal/samsung/acpm-tmu.c                 | 643 +++++++++++++++++++++
 .../linux/firmware/samsung/exynos-acpm-protocol.h  |  30 +
 13 files changed, 1275 insertions(+)
---
base-commit: e2211f5d980086dd9fbdab3bcd86b715e12cae13
change-id: 20260113-acpm-tmu-27e21f0e2c3b

Best regards,
-- 
Tudor Ambarus <tudor.ambarus@...aro.org>