linux-kernel - [PATCH v2 2/8] dt-bindings: thermal: Add qcom,qmi-cooling yaml bindings

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Message-Id: <20260127155722.2797783-3-gaurav.kohli@oss.qualcomm.com>
Date: Tue, 27 Jan 2026 21:27:16 +0530
From: Gaurav Kohli <gaurav.kohli@....qualcomm.com>
To: andersson@...nel.org, mathieu.poirier@...aro.org, robh@...nel.org,
        krzk+dt@...nel.org, conor+dt@...nel.org, rui.zhang@...el.com,
        lukasz.luba@....com, konradybcio@...nel.org, mani@...nel.org,
        casey.connolly@...aro.org, amit.kucheria@....qualcomm.com
Cc: linux-arm-msm@...r.kernel.org, devicetree@...r.kernel.org,
        linux-kernel@...r.kernel.org, linux-pm@...r.kernel.org,
        gaurav.kohli@....qualcomm.com, manaf.pallikunhi@....qualcomm.com
Subject: [PATCH v2 2/8] dt-bindings: thermal: Add qcom,qmi-cooling yaml bindings

The cooling subnode of a remoteproc represents a client of the Thermal
Mitigation Device QMI service running on it. Each subnode of the cooling
node represents a single control exposed by the service.

Signed-off-by: Gaurav Kohli <gaurav.kohli@....qualcomm.com>
---
 .../bindings/remoteproc/qcom,pas-common.yaml  |  6 ++
 .../bindings/thermal/qcom,qmi-cooling.yaml    | 72 +++++++++++++++++++
 2 files changed, 78 insertions(+)
 create mode 100644 Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml

diff --git a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
index 68c17bf18987..6a736161d5ae 100644
--- a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
+++ b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
@@ -80,6 +80,12 @@ properties:
       and devices related to the ADSP.
     unevaluatedProperties: false
 
+  cooling:
+    $ref: /schemas/thermal/qcom,qmi-cooling.yaml#
+    description:
+      Cooling subnode which represents the cooling devices exposed by the Modem.
+    unevaluatedProperties: false
+
 required:
   - clocks
   - clock-names
diff --git a/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml b/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml
new file mode 100644
index 000000000000..0dd3bd84c176
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml
@@ -0,0 +1,72 @@
+# SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause)
+
+%YAML 1.2
+---
+$id: http://devicetree.org/schemas/thermal/qcom,qmi-cooling.yaml#
+$schema: http://devicetree.org/meta-schemas/core.yaml#
+
+title: Qualcomm QMI based thermal mitigation (TMD) cooling devices
+
+maintainers:
+  - Gaurav Kohli <gaurav.kohli@....qualcomm.com>
+
+description:
+  Qualcomm QMI-based TMD cooling devices are used to mitigate thermal conditions
+  across multiple remote subsystems. These devices operate based on junction
+  temperature sensors (TSENS) associated with thermal zones for each subsystem.
+
+properties:
+  compatible:
+    enum:
+      - qcom,qmi-cooling-cdsp
+      - qcom,qmi-cooling-cdsp1
+
+patternProperties:
+  "cdsp-tmd[0-9]*$":
+    type: object
+
+    description:
+      Each subnode which represents qmi communication to CDSP.
+
+    properties:
+      label:
+        maxItems: 1
+
+      "#cooling-cells":
+        $ref: /schemas/thermal/thermal-cooling-devices.yaml#/properties/#cooling-cells
+
+    required:
+      - label
+      - "#cooling-cells"
+
+    additionalProperties: false
+
+required:
+  - compatible
+
+additionalProperties: false
+
+examples:
+  - |
+    remoteproc-cdsp {
+        cooling {
+            compatible = "qcom,qmi-cooling-cdsp";
+
+            cdsp_tmd0: cdsp-tmd0 {
+              label = "cdsp_sw";
+              #cooling-cells = <2>;
+            };
+        };
+    };
+
+  - |
+    remoteproc-cdsp1 {
+        cooling {
+            compatible = "qcom,qmi-cooling-cdsp1";
+
+            cdsp_tmd1: cdsp-tmd1 {
+              label = "cdsp_sw";
+              #cooling-cells = <2>;
+            };
+        };
+    };
-- 
2.34.1