linux-kernel - [PATCH v2 0/8] Add RemoteProc cooling support

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Message-Id: <20260127155722.2797783-1-gaurav.kohli@oss.qualcomm.com>
Date: Tue, 27 Jan 2026 21:27:14 +0530
From: Gaurav Kohli <gaurav.kohli@....qualcomm.com>
To: andersson@...nel.org, mathieu.poirier@...aro.org, robh@...nel.org,
        krzk+dt@...nel.org, conor+dt@...nel.org, rui.zhang@...el.com,
        lukasz.luba@....com, konradybcio@...nel.org, mani@...nel.org,
        casey.connolly@...aro.org, amit.kucheria@....qualcomm.com
Cc: linux-arm-msm@...r.kernel.org, devicetree@...r.kernel.org,
        linux-kernel@...r.kernel.org, linux-pm@...r.kernel.org,
        gaurav.kohli@....qualcomm.com, manaf.pallikunhi@....qualcomm.com
Subject: [PATCH v2 0/8] Add RemoteProc cooling support

This series introduces a generic remote proc cooling framework to control 
thermal sensors located on remote subsystem like modem, dsp etc.
Communications with these subsystems occurs through various channels, for example, 
QMI interface for Qualcomm.
 
The Framework provides an abstraction layer between thermal subsytem and vendor
specific remote subsystem. Vendor drivers are expected to implement callback 
and registration mechanisms with cooling framework to control cooling
devices.

This patchset also revives earlier discussions of QMI based TMD cooling
devices discussion posted on below series by Casey: 
https://lore.kernel.org/linux-devicetree/20230905-caleb-qmi_cooling-v1-0-5aa39d4164a7@linaro.org/

That series introduced Qualcomm QMI-based TMD cooling devices which used
to mitigate thermal conditions across multiple remote subsystems. These 
devices operate based on junction temperature sensors (TSENS) associated 
with thermal zones for each subsystem and registering with remoteproc 
cooling framework for cooling registration.
---
Changes in v2:
- Update Remoreproc thermal config to tristate and removed unnecessary NULL checks.
- Fixed dt binding file format and added generic name support for cdsp.
- Fixed memory leak and cleaned up qmi-cooling driver file.
- Corrected DT formatting errors and commit descriptions for all targets.
- Link to v1: https://lore.kernel.org/linux-devicetree/20251223123227.1317244-1-gaurav.kohli@oss.qualcomm.com/
---

Casey Connolly (2):
  remoteproc: qcom: probe all child devices
  thermal: qcom: add qmi-cooling driver

Gaurav Kohli (6):
  thermal: Add Remote Proc cooling driver
  dt-bindings: thermal: Add qcom,qmi-cooling yaml bindings
  arm64: dts: qcom: lemans: Enable CDSP cooling
  arm64: dts: qcom: talos: Enable CDSP cooling
  arm64: dts: qcom: kodiak: Enable CDSP cooling
  arm64: dts: qcom: monaco: Enable CDSP cooling

 .../bindings/remoteproc/qcom,pas-common.yaml  |   6 +
 .../bindings/thermal/qcom,qmi-cooling.yaml    |  72 +++
 MAINTAINERS                                   |   7 +
 arch/arm64/boot/dts/qcom/kodiak.dtsi          |  37 ++
 arch/arm64/boot/dts/qcom/lemans.dtsi          | 138 ++++-
 arch/arm64/boot/dts/qcom/monaco.dtsi          |  93 ++++
 arch/arm64/boot/dts/qcom/talos.dtsi           |  24 +
 drivers/remoteproc/qcom_q6v5.c                |   4 +
 drivers/remoteproc/qcom_q6v5_mss.c            |   8 -
 drivers/soc/qcom/Kconfig                      |  13 +
 drivers/soc/qcom/Makefile                     |   1 +
 drivers/soc/qcom/qmi-cooling.c                | 510 ++++++++++++++++++
 drivers/soc/qcom/qmi-cooling.h                | 429 +++++++++++++++
 drivers/thermal/Kconfig                       |  10 +
 drivers/thermal/Makefile                      |   2 +
 drivers/thermal/remoteproc_cooling.c          | 143 +++++
 include/linux/remoteproc_cooling.h            |  52 ++
 17 files changed, 1529 insertions(+), 20 deletions(-)
 create mode 100644 Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml
 create mode 100644 drivers/soc/qcom/qmi-cooling.c
 create mode 100644 drivers/soc/qcom/qmi-cooling.h
 create mode 100644 drivers/thermal/remoteproc_cooling.c
 create mode 100644 include/linux/remoteproc_cooling.h

-- 
2.34.1