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Message-ID: <wyvog73ymk26b5chg7afdjdqln2hcrvir5h234tuiuazmc5ktu@ptr7w2nbmlky>
Date: Fri, 30 Jan 2026 03:20:50 +0200
From: Dmitry Baryshkov <dmitry.baryshkov@....qualcomm.com>
To: Gaurav Kohli <gaurav.kohli@....qualcomm.com>
Cc: andersson@...nel.org, mathieu.poirier@...aro.org, robh@...nel.org,
krzk+dt@...nel.org, conor+dt@...nel.org, rui.zhang@...el.com,
lukasz.luba@....com, konradybcio@...nel.org, mani@...nel.org,
casey.connolly@...aro.org, amit.kucheria@....qualcomm.com,
linux-arm-msm@...r.kernel.org, devicetree@...r.kernel.org,
linux-kernel@...r.kernel.org, linux-pm@...r.kernel.org,
manaf.pallikunhi@....qualcomm.com
Subject: Re: [PATCH v2 5/8] arm64: dts: qcom: lemans: Enable CDSP cooling
On Thu, Jan 29, 2026 at 07:10:49PM +0530, Gaurav Kohli wrote:
>
> On 1/29/2026 5:59 PM, Dmitry Baryshkov wrote:
> > On Thu, Jan 29, 2026 at 05:40:56PM +0530, Gaurav Kohli wrote:
> > > On 1/29/2026 6:13 AM, Dmitry Baryshkov wrote:
> > > > On Tue, Jan 27, 2026 at 09:27:19PM +0530, Gaurav Kohli wrote:
> > > > > Unlike the CPU, the CDSP does not throttle its speed automatically
> > > > > when it reaches high temperatures in Lemans.
> > > > >
> > > > > Set up CDSP cooling by throttling the cdsp when it reaches 105°C.
> > > > >
> > > > > Signed-off-by: Gaurav Kohli <gaurav.kohli@....qualcomm.com>
> > > > > ---
> > > > > arch/arm64/boot/dts/qcom/lemans.dtsi | 138 ++++++++++++++++++++++++---
> > > > > 1 file changed, 126 insertions(+), 12 deletions(-)
> > > > >
> > > > > diff --git a/arch/arm64/boot/dts/qcom/lemans.dtsi b/arch/arm64/boot/dts/qcom/lemans.dtsi
> > > > > index 808827b83553..c747dd534caa 100644
> > > > > --- a/arch/arm64/boot/dts/qcom/lemans.dtsi
> > > > > +++ b/arch/arm64/boot/dts/qcom/lemans.dtsi
> > > > > @@ -7281,6 +7281,15 @@ compute-cb@11 {
> > > > > };
> > > > > };
> > > > > };
> > > > > +
> > > > > + cooling {
> > > > > + compatible = "qcom,qmi-cooling-cdsp";
> > > > > +
> > > > > + cdsp_tmd0: cdsp-tmd0 {
> > > > This question was already raised. Are there more than one cooling device
> > > > for the DSP? If not, drop the subnodes.
> > >
> > > Thanks Dmitry for review.
> > >
> > > Yes, Each subsystem may support multiple thermal mitigation devices through
> > > remote TMD service.
> > May or does?
>
>
> It does support. that's why need child node to trigger different mitigation.
Then please inside a DT bindings provide a definitive example, demonstrating
that. Otherwise, reviewers can observe only one cooling device per DSP.
>
>
> >
> > > So, need to define subnodes.
> > >
> > >
> > > > > + label = "cdsp_sw";
> > > > > + #cooling-cells = <2>;
> > > > > + };
> > > > > + };
> > > > > };
> > > > > nspb_noc: interconnect@...c0000 {
--
With best wishes
Dmitry
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