linux-kernel - Re: [PATCH v1 0/8] Add RemoteProc cooling support

lists.openwall.net		lists / announce owl-users owl-dev john-users john-dev passwdqc-users yescrypt popa3d-users / oss-security kernel-hardening musl sabotage tlsify passwords / crypt-dev xvendor / Bugtraq Full-Disclosure linux-kernel linux-netdev linux-ext4 linux-hardening linux-cve-announce PHC
Open Source and information security mailing list archives

Hash Suite: Windows password security audit tool. GUI, reports in PDF.

[<prev] [next>] [<thread-prev] [thread-next>] [day] [month] [year] [list]

Message-ID: <cca414ad-0a98-467a-af31-72d40c43e27a@oss.qualcomm.com>
Date: Sun, 1 Feb 2026 12:20:23 -0800
From: Trilok Soni <trilokkumar.soni@....qualcomm.com>
To: Gaurav Kohli <gaurav.kohli@....qualcomm.com>,
        Casey Connolly <casey.connolly@...aro.org>, andersson@...nel.org,
        mathieu.poirier@...aro.org, robh@...nel.org, krzk+dt@...nel.org,
        conor+dt@...nel.org, rafael@...nel.org, daniel.lezcano@...aro.org,
        rui.zhang@...el.com, lukasz.luba@....com, konradybcio@...nel.org,
        amitk@...nel.org, mani@...nel.org
Cc: linux-arm-msm@...r.kernel.org, devicetree@...r.kernel.org,
        linux-kernel@...r.kernel.org, linux-pm@...r.kernel.org
Subject: Re: [PATCH v1 0/8] Add RemoteProc cooling support

On 1/13/2026 1:33 AM, Gaurav Kohli wrote:
> 
> On 1/10/2026 9:43 PM, Casey Connolly wrote:
>>
>>
>> On 12/23/25 13:32, Gaurav Kohli wrote:
>>> This series introduces a generic remote proc cooling framework to control
>>> thermal sensors located on remote subsystem like modem, dsp etc.
>>> Communications with these subsystems occurs through various channels, for example,
>>> QMI interface for Qualcomm.
>>>   The Framework provides an abstraction layer between thermal subsytem and vendor
>>> specific remote subsystem. Vendor drivers are expected to implement callback
>>> and registration mechanisms with cooling framework to control cooling
>>> devices.
>>>
>>> This patchset also revives earlier discussions of QMI based TMD cooling
>>> devices discussion posted on below series by Casey:
>>> https://lore.kernel.org/linux-devicetree/20230905-caleb-qmi_cooling-v1-0-5aa39d4164a7@linaro.org/
>>>
>>> That series introduced Qualcomm QMI-based TMD cooling devices which used
>>> to mitigate thermal conditions across multiple remote subsystems. These
>>> devices operate based on junction temperature sensors (TSENS) associated
>>> with thermal zones for each subsystem and registering with remoteproc
>>> cooling framework for cooling registration.
>>>
>>> This patch series has a compilation/runtime dependency on another series [1].
>>>
>>> [1] https://lore.kernel.org/linux-devicetree/20250822042316.1762153-1-quic_gkohli@quicinc.com/
>>>
>>> Casey Connolly (2):
>>>    remoteproc: qcom: probe all child devices
>>>    thermal: qcom: add qmi-cooling driver
>>
>> I'm glad this series is getting revived. It would be good if you could explain what changes you made to my patches somewhere.
>>
>> I also remember one of my patches adding the DT parts for SDM845, would you be willing to pick that up for the next revision? I'd be happy to provide my Tested-by.
>>
>> Kind regards,
>>
> Hi Casey,
> 
> With this remoeproc cooling abstraction layer, we have integrated your patches for subsystem cooling. As lot of comments came for qmi-cooling driver, so need to send v2 with cleanup.

Gaurav - the question somewhere in the series was that why you had marked your patch series 
to v1, when you had revived the original (v1?) series from Casey? Should we consider
current patch series as v2 then? I don't know if that comment was concluded. 

---Trilok Soni