linux-kernel - Re: [PATCH 3/3] usb: dwc3: introduce flatten model driver of i.MX Soc

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Message-ID: <20260203004453.rez3u2oiltciccfp@synopsys.com>
Date: Tue, 3 Feb 2026 00:44:57 +0000
From: Thinh Nguyen <Thinh.Nguyen@...opsys.com>
To: Frank Li <Frank.li@....com>
CC: Xu Yang <xu.yang_2@....com>,
        Greg Kroah-Hartman <gregkh@...uxfoundation.org>,
        Rob Herring <robh@...nel.org>,
        Krzysztof Kozlowski <krzk+dt@...nel.org>,
        Conor Dooley <conor+dt@...nel.org>, Shawn Guo <shawnguo@...nel.org>,
        Sascha Hauer <s.hauer@...gutronix.de>,
        Pengutronix Kernel Team <kernel@...gutronix.de>,
        Fabio Estevam <festevam@...il.com>, Li Jun <jun.li@....com>,
        Thinh Nguyen <Thinh.Nguyen@...opsys.com>,
        "linux-usb@...r.kernel.org" <linux-usb@...r.kernel.org>,
        "devicetree@...r.kernel.org" <devicetree@...r.kernel.org>,
        "imx@...ts.linux.dev" <imx@...ts.linux.dev>,
        "linux-arm-kernel@...ts.infradead.org" <linux-arm-kernel@...ts.infradead.org>,
        "linux-kernel@...r.kernel.org" <linux-kernel@...r.kernel.org>
Subject: Re: [PATCH 3/3] usb: dwc3: introduce flatten model driver of i.MX Soc

On Mon, Feb 02, 2026, Frank Li wrote:
> On Mon, Feb 02, 2026 at 06:27:47PM +0800, Xu Yang wrote:
> > To support flatten dwc3 devicetree model, introduce a new driver.
> >
> > Signed-off-by: Xu Yang <xu.yang_2@....com>

Can you include additional info to describe why this was needed
(written in your cover letter).

Also note any new feature supported by this glue that's not currently
available in the old driver.

Thanks,
Thinh

(ps. I'm thinking of creating a legacy_glues directory to start moving
all the legacy glue drivers there)