linux-kernel - Re: [PATCH 3/3] usb: dwc3: introduce flatten model driver of i.MX Soc

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Message-ID: <q7g6ssporjzbhtmnhbruu545vi7jh7qkmrirx6ncqbz7ltujj5@fqzs6tbntgyn>
Date: Wed, 4 Feb 2026 14:19:42 +0800
From: Xu Yang <xu.yang_2@....com>
To: Thinh Nguyen <Thinh.Nguyen@...opsys.com>
Cc: Frank Li <Frank.li@....com>, 
	Greg Kroah-Hartman <gregkh@...uxfoundation.org>, Rob Herring <robh@...nel.org>, 
	Krzysztof Kozlowski <krzk+dt@...nel.org>, Conor Dooley <conor+dt@...nel.org>, 
	Shawn Guo <shawnguo@...nel.org>, Sascha Hauer <s.hauer@...gutronix.de>, 
	Pengutronix Kernel Team <kernel@...gutronix.de>, Fabio Estevam <festevam@...il.com>, Li Jun <jun.li@....com>, 
	"linux-usb@...r.kernel.org" <linux-usb@...r.kernel.org>, "devicetree@...r.kernel.org" <devicetree@...r.kernel.org>, 
	"imx@...ts.linux.dev" <imx@...ts.linux.dev>, 
	"linux-arm-kernel@...ts.infradead.org" <linux-arm-kernel@...ts.infradead.org>, "linux-kernel@...r.kernel.org" <linux-kernel@...r.kernel.org>
Subject: Re: [PATCH 3/3] usb: dwc3: introduce flatten model driver of i.MX Soc

On Tue, Feb 03, 2026 at 12:44:57AM +0000, Thinh Nguyen wrote:
> On Mon, Feb 02, 2026, Frank Li wrote:
> > On Mon, Feb 02, 2026 at 06:27:47PM +0800, Xu Yang wrote:
> > > To support flatten dwc3 devicetree model, introduce a new driver.
> > >
> > > Signed-off-by: Xu Yang <xu.yang_2@....com>
> 
> Can you include additional info to describe why this was needed
> (written in your cover letter).

Sure.

> 
> Also note any new feature supported by this glue that's not currently
> available in the old driver.

OK. No new feature in this driver.

> 
> Thanks,
> Thinh
> 
> (ps. I'm thinking of creating a legacy_glues directory to start moving
> all the legacy glue drivers there)

Got it. Thanks for sharing the info.

Thanks,
Xu Yang