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Message-ID: <20070330003630.GA18319@gospo.rdu.redhat.com>
Date: Thu, 29 Mar 2007 20:36:31 -0400
From: Andy Gospodarek <andy@...yhouse.net>
To: Chris Friesen <cfriesen@...tel.com>
Cc: Jay Vosburgh <fubar@...ibm.com>, netdev@...r.kernel.org,
bonding-devel@...ts.sourceforge.net
Subject: Re: [Bonding-devel] quick help with bonding?
On Thu, Mar 29, 2007 at 05:42:54PM -0600, Chris Friesen wrote:
> Jay Vosburgh wrote:
>
> > 2.6.10 is pretty old, and there have been a number of fixes to
> > the bonding ARP monitor since then, so it may be that it is simply
> > misbehaving (presuming that you're running the 2.6.10 bonding driver).
> > Are you in a position to test against a more recent kernel (and/or
> > bonding driver)? Does the miimon misbehave in a similar fashion?
>
> Testing a more recent kernel is problematic. A new bonding driver could
> be possible, assuming the code hasn't changed too much.
If you are looking for a decent source for patches you could consider
downloading the latest source-rpm from RHEL4/CentOS4. The bonding
driver in those releases have been updated to much later code and I can
tell you from personal experience they work pretty well. You may need
to do some backporting to get the latest arp-monitoring features, but
let me know if you need a hand with that, I might have some laying
around. ;)
> I just did another experiment. Normally we boot via eth4 (which then
> becomes part of the bond with eth5 at init time). If I boot via eth6
> instead, it appears as though the problem doesn't show up.
Does eth6 use the same hardware/driver as eth4/5? (Sorry if I missed
that in the thread, but didn't see if you indicated that it did.)
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