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Date: Fri, 16 May 2014 22:29:50 -0400 (EDT) From: David Miller <davem@...emloft.net> To: vyasevic@...hat.com Cc: netdev@...r.kernel.org, vfalico@...il.com, kaber@...sh.net, j.vosburgh@...il.com, andy@...yhouse.net Subject: Re: [PATCH v2 0/2] Fixed stacked vlan usage on top of bonds From: Vlad Yasevich <vyasevic@...hat.com> Date: Fri, 16 May 2014 17:20:37 -0400 > Bonding device driver now support q-in-q on top for bonds. There are > a few issues here though. > > First, when arp monitoring is used, bonding driver will not correctly > tag traffic if the source of the arp device was configured on top of > q-in-q. It may also incorrectly pick the wrong vlan id if the ordering > of that upper devices isn't as expected (there is no guarntee on ordering). > > Second, the alb/tlb may use what would be considered 'inner' vlans in > its learning announcements, as it simply announces all vlans configured > on top of the bond without regard for encapsulation/stacking. > > This series fixes the above 2 issues. This series also depends on the > functionality introduced in > http://patchwork.ozlabs.org/patch/349766/ > > Since v1: > - Changed how patch1 verifies the device path. We no longer use the > _all_upper version of the function. We find the path and if it was > found, then collect the vlan information. > - Use the constant to devine maximum vlan nest level support on top > of bonding. This can be changed if 2 is too low. > - Inlude patch2 into the series. Series applied, thanks Vlad. -- To unsubscribe from this list: send the line "unsubscribe netdev" in the body of a message to majordomo@...r.kernel.org More majordomo info at http://vger.kernel.org/majordomo-info.html
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