netdev - Re: [PATCH 1/8] net/mlx5: Update the driver with the recent thermal changes

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Message-ID: <ZHB53sm0od4RvsKe@corigine.com>
Date: Fri, 26 May 2023 11:20:30 +0200
From: Simon Horman <simon.horman@...igine.com>
To: Daniel Lezcano <daniel.lezcano@...aro.org>
Cc: rafael@...nel.org, linux-pm@...r.kernel.org, thierry.reding@...il.com,
	Sandipan Patra <spatra@...dia.com>, Gal Pressman <gal@...dia.com>,
	Saeed Mahameed <saeedm@...dia.com>,
	Jakub Kicinski <kuba@...nel.org>, Leon Romanovsky <leon@...nel.org>,
	"David S. Miller" <davem@...emloft.net>,
	Eric Dumazet <edumazet@...gle.com>, Paolo Abeni <pabeni@...hat.com>,
	"open list:MELLANOX MLX5 core VPI driver" <netdev@...r.kernel.org>,
	"open list:MELLANOX MLX5 core VPI driver" <linux-rdma@...r.kernel.org>,
	open list <linux-kernel@...r.kernel.org>
Subject: Re: [PATCH 1/8] net/mlx5: Update the driver with the recent thermal
 changes

On Thu, May 25, 2023 at 04:01:28PM +0200, Daniel Lezcano wrote:
> The thermal framework is migrating to the generic trip points. The set
> of changes also implies a self-encapsulation of the thermal zone
> device structure where the internals are no longer directly accessible
> but with accessors.
> 
> Use the new API instead, so the next changes can be pushed in the
> thermal framework without this driver failing to compile.
> 
> No functional changes intended.
> 
> Cc: Sandipan Patra <spatra@...dia.com>
> Cc: Gal Pressman <gal@...dia.com>
> Cc: Saeed Mahameed <saeedm@...dia.com>
> Cc: Jakub Kicinski <kuba@...nel.org>
> Signed-off-by: Daniel Lezcano <daniel.lezcano@...aro.org>

Reviewed-by: Simon Horman <simon.horman@...igine.com>